Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11289430 | Semiconductor package and a method for manufacturing the same | Won-Gi Chang | 2022-03-29 |
| 10431536 | Interposer substrate and semiconductor package | Hyon-chol Kim, Ok-Gyeong Park | 2019-10-01 |
| 9627126 | Printed circuit board including inductor | Hyun Jong MOON, Seong-Ho Shin | 2017-04-18 |
| 8970042 | Circuit board, comprising a core insulation film | Chul Woo Kim, Kyung-Tae Na, Young Bae Kim, Yong Hoon Kim, Hee-Seok Lee | 2015-03-03 |