Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10950521 | Thermal interface material layer and package-on-package device including the same | Jongkook Kim, Hyo-Chang Ryu, Jin-Woo Park, BongJin Son, Jangwoo Lee | 2021-03-16 |
| 10593652 | Stacked semiconductor packages | Heung-Kyu Kwon, Sung-Woo Park, Ji Hyun Park, Su-Min Park | 2020-03-17 |
| 10431522 | Thermal interface material layer and package-on-package device including the same | Jongkook Kim, Hyo-Chang Ryu, Jin-Woo Park, BongJin Son, Jangwoo Lee | 2019-10-01 |
| 10403606 | Method of fabricating a semiconductor package | Heung-Kyu Kwon, Sung-Woo Park, Ji Hyun Park, Su-Min Park | 2019-09-03 |
| 9978721 | Apparatus for stacked semiconductor packages and methods of fabricating the same | Heung-Kyu Kwon, Sung-Woo Park, Ji Hyun Park, Su-Min Park | 2018-05-22 |
| 9899294 | Thermal interface material layer and package-on-package device including the same | Jongkook Kim, Hyo-Chang Ryu, Jin-Woo Park, BongJin Son, Jangwoo Lee | 2018-02-20 |
| 9214484 | Image sensor packages | Ok-Gyeong Park | 2015-12-15 |
| 9040351 | Stack packages having fastening element and halogen-free inter-package connector | Heung-Kyu Kwon, Jae-Wook Yoo, Hyon-chol Kim, Su-chang Lee | 2015-05-26 |
| 9042115 | Stacked semiconductor packages | Heung-Kyu Kwon, Sung-Woo Park, Ji Hyun Park, Su-Min Park | 2015-05-26 |
| 8829686 | Package-on-package assembly including adhesive containment element | Ji-Sun Hong, Young Min Kim, Jung Woo Kim, Hyo-Chang Ryu, Jong Bo Shim | 2014-09-09 |
| 8709879 | Method of forming a semiconductor package | Ji Hyun Park, Heungkyu Kwon, Taehwan Kim | 2014-04-29 |
| 8508954 | Systems employing a stacked semiconductor package | Heung-Kyu Kwon, Sung-Woo Park, Ji Hyun Park, Su-Min Park | 2013-08-13 |
| 8426959 | Semiconductor package and method of manufacturing the same | Ji Hyun Park, Heungkyu Kwon, Taehwan Kim | 2013-04-23 |