Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12278248 | Image sensor package and method of fabricating the same | — | 2025-04-15 |
| 12062594 | Integrated circuit device including a through-via structure | — | 2024-08-13 |
| 10950521 | Thermal interface material layer and package-on-package device including the same | Min-Ok Na, Jongkook Kim, Hyo-Chang Ryu, Jin-Woo Park, Jangwoo Lee | 2021-03-16 |
| 10431522 | Thermal interface material layer and package-on-package device including the same | Min-Ok Na, Jongkook Kim, Hyo-Chang Ryu, Jin-Woo Park, Jangwoo Lee | 2019-10-01 |
| 10319619 | Equipment for manufacturing semiconductor devices and method for use of same for manufacturing semiconductor package components | Yose Eum, Jangwoo Lee | 2019-06-11 |
| 9899294 | Thermal interface material layer and package-on-package device including the same | Min-Ok Na, Jongkook Kim, Hyo-Chang Ryu, Jin-Woo Park, Jangwoo Lee | 2018-02-20 |