Issued Patents All Time
Showing 1–25 of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10593652 | Stacked semiconductor packages | Min-Ok Na, Sung-Woo Park, Ji Hyun Park, Su-Min Park | 2020-03-17 |
| 10403606 | Method of fabricating a semiconductor package | Min-Ok Na, Sung-Woo Park, Ji Hyun Park, Su-Min Park | 2019-09-03 |
| 10056321 | Semiconductor package and method for routing the package | Jong Kook Kim | 2018-08-21 |
| 10025354 | System module and mobile computing device including the same | — | 2018-07-17 |
| 9984032 | System on package (SoP) having through silicon via (TSV) interposer with memory controller connected to multiple printed circuit boards (PCB) | — | 2018-05-29 |
| 9978721 | Apparatus for stacked semiconductor packages and methods of fabricating the same | Min-Ok Na, Sung-Woo Park, Ji Hyun Park, Su-Min Park | 2018-05-22 |
| 9839127 | System of package (SoP) module and mobile computing device having the SoP | Kyoung-Mook Lim | 2017-12-05 |
| 9811122 | Package on packages and mobile computing devices having the same | — | 2017-11-07 |
| 9665122 | Semiconductor device having markings and package on package including the same | Hae-Gu Lee, Byeong-Yeon Cho | 2017-05-30 |
| 9640499 | Semiconductor chip, flip chip package and wafer level package including the same | — | 2017-05-02 |
| 9601458 | Stacked semiconductor package including connections electrically connecting first and second semiconductor packages | Su-chang Lee | 2017-03-21 |
| 9048168 | Semiconductor packages having warpage compensation | Seok-Won Lee, Hyon-chol Kim, Su-chang Lee, Chi-Young Lee | 2015-06-02 |
| 9042115 | Stacked semiconductor packages | Min-Ok Na, Sung-Woo Park, Ji Hyun Park, Su-Min Park | 2015-05-26 |
| 9040351 | Stack packages having fastening element and halogen-free inter-package connector | Jae-Wook Yoo, Hyon-chol Kim, Su-chang Lee, Min-Ok Na | 2015-05-26 |
| 8981581 | Semiconductor devices, package substrates, semiconductor packages, package stack structures, and electronic systems having functionally asymmetric conductive elements | Seong-Ho Shin, Yun-Seok Choi, Yong Hoon Kim | 2015-03-17 |
| 8963308 | Semiconductor packages including a plurality of upper semiconductor devices on a lower semiconductor device | Young Bae Kim, Yun-Hee Lee | 2015-02-24 |
| 8817486 | Semiconductor package having multi pitch ball land | Tong-suk Kim, Jeong-O Ha, Hyun A Kim | 2014-08-26 |
| 8716872 | Stacked semiconductor package including connections electrically connecting first and second semiconductor packages | Su-chang Lee | 2014-05-06 |
| 8698301 | Semiconductor packages including a plurality of upper semiconductor devices on a lower semiconductor device | Young Bae Kim, Yun-Hee Lee | 2014-04-15 |
| 8680667 | Semiconductor devices, package substrates, semiconductor packages, package stack structures, and electronic systems having functionally asymmetric conductive elements | Seong-Ho Shin, Yun-Seok Choi, Yong Hoon Kim | 2014-03-25 |
| 8618671 | Semiconductor packages having passive elements mounted thereonto | Hyung-jun Lim, Byeong-Yeon Cho | 2013-12-31 |
| 8604614 | Semiconductor packages having warpage compensation | Seok-Won Lee, Hyon-chol Kim, Su-chang Lee, Chi-Young Lee | 2013-12-10 |
| 8546954 | Stacked semiconductor package having electrical connections or varying heights between substrates, and semiconductor device including the stacked semiconductor package | Su-chang Lee | 2013-10-01 |
| 8508954 | Systems employing a stacked semiconductor package | Min-Ok Na, Sung-Woo Park, Ji Hyun Park, Su-Min Park | 2013-08-13 |
| 8400779 | Semiconductor package having multi pitch ball land | Tong-suk Kim, Jeong-O Ha, Hyun A Kim | 2013-03-19 |