Issued Patents All Time
Showing 26–48 of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7994643 | Stack package, a method of manufacturing the stack package, and a digital device having the stack package | Tae Hun Kim, Sang-Uk Kim | 2011-08-09 |
| 7928555 | Stack semiconductor package including an interposer chip having an imposed diode or capacitor | Tae Hun Kim | 2011-04-19 |
| 7868443 | Vertical stack type multi-chip package having improved grounding performance and lower semiconductor chip reliability | Tae Hun Kim, Su-chang Lee | 2011-01-11 |
| 7812442 | High-power ball grid array package, heat spreader used in the BGA package and method for manufacturing the same | Tae-Je Cho, Min-ha Kim | 2010-10-12 |
| 7795743 | Wiring substrate having variously sized ball pads, semiconductor package having the wiring substrate, and stack package using the semiconductor package | Tae Hun Kim, Hak-Kyoon Byun, Sung Yong Park | 2010-09-14 |
| 7776650 | Method for fabricating a flip chip system in package | Tae Hun Kim, Jeong-O Ha | 2010-08-17 |
| 7615415 | Vertical stack type multi-chip package having improved grounding performance and lower semiconductor chip reliability | Tae Hun Kim, Su-chang Lee | 2009-11-10 |
| 7566954 | Bonding configurations for lead-frame-based and substrate-based semiconductor packages | Kyung-Lae Jang, Hee-Seok Lee | 2009-07-28 |
| 7541680 | Semiconductor device package | Se Nyun Kim, Tae Hun Kim, Jeong-O Ha, Hak-Kyoon Byun, Sung Yong Park | 2009-06-02 |
| 7517723 | Method for fabricating a flip chip system in package | Tae Hun Kim, Jeong-O Ha | 2009-04-14 |
| 7327038 | Semiconductor device package | Tae-Je Cho, Kyung-Lae Jang | 2008-02-05 |
| 7327020 | Multi-chip package including at least one semiconductor device enclosed therein | Hee-Seok Lee | 2008-02-05 |
| 7258808 | High-power ball grid array package, heat spreader used in the BGA package and method for manufacturing the same | Tae-Je Cho, Min-ha Kim | 2007-08-21 |
| 7211469 | Semiconductor wafer having electrically connected passive device chips, passive devices and semiconductor package using the same | — | 2007-05-01 |
| 7078800 | Semiconductor package | Se-Yong Oh, Min-ha Kim, Tae-Je Cho | 2006-07-18 |
| 7005320 | Method for manufacturing flip chip package devices with a heat spreader | — | 2006-02-28 |
| 6952050 | Semiconductor package | Se-Yong Oh, Min-ha Kim, Tae-Je Cho | 2005-10-04 |
| 6943430 | Semiconductor wafer having electrically connected passive device chips, passive devices and semiconductor package using the same | — | 2005-09-13 |
| 6903451 | Chip scale packages manufactured at wafer level | Nam-Seog Kim, Dong-Hyeon Jang, Sa-Yoon Kang | 2005-06-07 |
| 6608380 | Semiconductor chip package having one or more sealing screws | Young-Hoon Ro, Jung Hwan Chun | 2003-08-19 |
| 6518660 | Semiconductor package with ground projections | Tae-Je Cho, Young-Hoon Ro | 2003-02-11 |
| 6187615 | Chip scale packages and methods for manufacturing the chip scale packages at wafer level | Nam-Seog Kim, Dong-Hyeon Jang, Sa-Yoon Kang | 2001-02-13 |
| 5250840 | Semiconductor lead frame with a chip having bonding pads in a cross arrangement | Dong-Yean Oh, Hyeon J. Jeong | 1993-10-05 |