Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12279449 | Semiconductor devices having upper and lower active contacts | Seung Jae Lee, Jong-Min Baek, Kyung-Seok Oh, Woo Jin Lee | 2025-04-15 |
| 11955531 | Method of forming an integrated circuit device having a contact capping layer | Dae Young Kwak, Ji-ye Kim, Min Chan Gwak, Dong-Hyun Roh, Jin-Wook Lee +1 more | 2024-04-09 |
| 11626503 | Integrated circuit device having fin-type active | Dae Young Kwak, Ji-ye Kim, Min Chan Gwak, Dong-Hyun Roh, Jin-Wook Lee +1 more | 2023-04-11 |
| 11114544 | Integrated circuit device having fin-type active | Dae Young Kwak, Ji-ye Kim, Min Chan Gwak, Dong-Hyun Roh, Jin-Wook Lee +1 more | 2021-09-07 |
| 9024452 | Semiconductor package comprising an interposer and method of manufacturing the same | — | 2015-05-05 |
| 8952514 | Semiconductor package | — | 2015-02-10 |
| 8912662 | Wafer-level package and method of manufacturing the same | — | 2014-12-16 |
| 8785254 | Method of manufacturing high-capacity semiconductor package | — | 2014-07-22 |
| 8222120 | Method of dicing wafer using plasma | Gyu Han Kim | 2012-07-17 |
| 8202744 | Wafer through silicon via forming method and equipment therefor | Gyu Han Kim | 2012-06-19 |
| 6608380 | Semiconductor chip package having one or more sealing screws | Young-Hoon Ro, Heung-Kyu Kwon | 2003-08-19 |