Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8222120 | Method of dicing wafer using plasma | Jung Hwan Chun | 2012-07-17 |
| 8202744 | Wafer through silicon via forming method and equipment therefor | Jung Hwan Chun | 2012-06-19 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8222120 | Method of dicing wafer using plasma | Jung Hwan Chun | 2012-07-17 |
| 8202744 | Wafer through silicon via forming method and equipment therefor | Jung Hwan Chun | 2012-06-19 |