Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12426227 | Method of manufacturing a semiconductor device having a node capping pattern and a gate capping pattern | Sung Hun Jung, Heon-Jong Shin, Sung Moon Lee, Jeong-Ki Hwang | 2025-09-23 |
| 12015063 | Method of manufacturing an integrated circuit device including a fin-type active region | Chang-yeon Lee, Jin-Wook Lee, Kye Hyun Baek, Hong-Bae Park | 2024-06-18 |
| 11955531 | Method of forming an integrated circuit device having a contact capping layer | Dae Young Kwak, Ji-ye Kim, Jung Hwan Chun, Dong-Hyun Roh, Jin-Wook Lee +1 more | 2024-04-09 |
| 11778801 | Semiconductor device having a node capping pattern and a gate capping pattern | Sung Hun Jung, Heon-Jong Shin, Sung Moon Lee, Jeong-Ki Hwang | 2023-10-03 |
| 11721581 | Semiconductor devices including contact plugs | Hwi-Chan Jun, Heon-Jong Shin, So Ra YOU, Sang Hyun Lee, In-chan Hwang | 2023-08-08 |
| 11626503 | Integrated circuit device having fin-type active | Dae Young Kwak, Ji-ye Kim, Jung Hwan Chun, Dong-Hyun Roh, Jin-Wook Lee +1 more | 2023-04-11 |
| 11309393 | Integrated circuit device including an overhanging hard mask layer | Chang-yeon Lee, Jin-Wook Lee, Kye Hyun Baek, Hong-Bae Park | 2022-04-19 |
| 11189572 | Maintaining height of alignment key in semiconductor devices | Kyung-Tae Lee, Seung-Hoon Choi, Ja-Eung Koo, Sang Hyun Park | 2021-11-30 |
| 11114544 | Integrated circuit device having fin-type active | Dae Young Kwak, Ji-ye Kim, Jung Hwan Chun, Dong-Hyun Roh, Jin-Wook Lee +1 more | 2021-09-07 |
| 10818549 | Semiconductor devices including contact plugs | Hwi-Chan Jun, Heon-Jong Shin, So Ra YOU, Sang Hyun Lee, In-chan Hwang | 2020-10-27 |
| 10658288 | Semiconductor device having a metal via | Seul-Ki Hong, Heon-Jong Shin, Hwi-Chan Jun | 2020-05-19 |
| 10553484 | Semiconductor devices including contact plugs | Hwi-Chan Jun, Heon-Jong Shin, So Ra YOU, Sang Hyun Lee, In-chan Hwang | 2020-02-04 |
| 10340219 | Semiconductor device having a metal via | Seul-Ki Hong, Heon-Jong Shin, Hwi-Chan Jun | 2019-07-02 |