Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7663221 | Package circuit board with a reduced number of pins and package including a package circuit board with a reduced number of pins and methods of manufacturing the same | Hee-Seok Lee | 2010-02-16 |
| 7652367 | Semiconductor package on package having plug-socket type wire connection between packages | Kwon-Young Roh | 2010-01-26 |
| 7566954 | Bonding configurations for lead-frame-based and substrate-based semiconductor packages | Hee-Seok Lee, Heung-Kyu Kwon | 2009-07-28 |
| 7374969 | Semiconductor package with conductive molding compound and manufacturing method thereof | Byeong-Yeon Cho, Hee-Seok Lee | 2008-05-20 |
| 7372139 | Semiconductor chip package | Hee-Seok Lee | 2008-05-13 |
| 7330084 | Printed circuit board having a bond wire shield structure for a signal transmission line | Hee-Seok Lee, Tae-Je Cho, Ki-Won Choi | 2008-02-12 |
| 7327038 | Semiconductor device package | Heung-Kyu Kwon, Tae-Je Cho | 2008-02-05 |