Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12033991 | Package-on-package (PoP) semiconductor package and electronic system including the same | Tong-suk Kim | 2024-07-09 |
| 11552062 | Package-on-package (PoP) semiconductor package and electronic system including the same | Tong-suk Kim | 2023-01-10 |
| 10971484 | Package-on-package (PoP) semiconductor package and electronic system including the same | Tong-suk Kim | 2021-04-06 |
| 10692846 | Package-on-package (PoP) semiconductor package and electronic system including the same | Tong-suk Kim | 2020-06-23 |
| 10546844 | Stack package and method of manufacturing the stack package | Jae Choon Kim, Eon Soo Jang, Eun-Hee Jung, Hyon-chol Kim | 2020-01-28 |
| 9665122 | Semiconductor device having markings and package on package including the same | Heung-Kyu Kwon, Hae-Gu Lee | 2017-05-30 |
| 8618671 | Semiconductor packages having passive elements mounted thereonto | Heung-Kyu Kwon, Hyung-jun Lim | 2013-12-31 |
| 8253228 | Package on package structure | Yong Hoon Kim, Hee-Seok Lee | 2012-08-28 |
| 7928435 | Interposer chip and multi-chip package having the interposer chip | Sung Yong Park, Tae-Je Cho, Tae Hun Kim, Jong Kook Kim | 2011-04-19 |
| 7374969 | Semiconductor package with conductive molding compound and manufacturing method thereof | Hee-Seok Lee, Kyung-Lae Jang | 2008-05-20 |