JK

Jong Kook Kim

SC Stats Chippac: 9 patents #91 of 425Top 25%
CH Chippac: 5 patents #4 of 42Top 10%
Samsung: 4 patents #25,854 of 75,807Top 35%
KI Korea Atomic Energy Research Institute: 1 patents #426 of 972Top 45%
KP Korea Electric Power: 1 patents #216 of 605Top 40%
PC Posco Co.: 1 patents #573 of 1,176Top 50%
IC Infac Elecs Co.: 1 patents #5 of 17Top 30%
HC Hyundai Electronics Co.: 1 patents #4 of 43Top 10%
Overall (All Time): #183,245 of 4,157,543Top 5%
23
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
11063346 Shark fin antenna for vehicle Tae-Hoon Yang, Sang-hoon Lim, Soo Young Hwang, Ki Seok Uhm, Kyu Chang Nam +1 more 2021-07-13
10391518 Method for manufacturing transparent pattern print steel plate Jin Tae Kim, Jong-Sang Kim, Bong-Woo Ha, Yang-Ho Choi, Jung Hwan Lee +1 more 2019-08-27
10056321 Semiconductor package and method for routing the package Heung-Kyu Kwon 2018-08-21
9349713 Semiconductor package stack structure having interposer substrate Byoung Wook Jang 2016-05-24
9129826 Epoxy bump for overhang die Hun Teak Lee, Chul-Sik Kim, Ki Youn Jang 2015-09-08
8519517 Semiconductor system with fine pitch lead fingers and method of manufacturing thereof Hun Teak Lee, ChulSik Kim, Ki Youn Jang 2013-08-27
8256660 Semiconductor package system with fine pitch lead fingers and method of manufacturing thereof Hun Teak Lee, ChulSik Kim, Ki Youn Jang 2012-09-04
8129263 Wire bond interconnection and method of manufacture thereof Hun Teak Lee, Chul-Sik Kim, Ki Youn Jang, Rajendra D. Pendse 2012-03-06
7986047 Wire bond interconnection Hun Teak Lee, Chul-Sik Kim, Ki Youn Jang, Rajendra D. Pendse 2011-07-26
7928435 Interposer chip and multi-chip package having the interposer chip Sung Yong Park, Tae-Je Cho, Tae Hun Kim, Byeong-Yeon Cho 2011-04-19
7909233 Method of manufacturing a semiconductor package with fine pitch lead fingers Hun Teak Lee, ChulSik Kim, Ki Youn Jang 2011-03-22
7745322 Wire bond interconnection Hun Teak Lee, Chul-Sik Kim, Ki Youn Jang, Rajendra D. Pendse 2010-06-29
7731078 Semiconductor system with fine pitch lead fingers Hun Teak Lee, ChulSik Kim, Ki Youn Jang 2010-06-08
7652382 Micro chip-scale-package system Hun Teak Lee, Jason Lee 2010-01-26
7453156 Wire bond interconnection Hun Teak Lee, Chul-Sik Kim, Ki Youn Jang, Rajendra D. Pendse 2008-11-18
7429798 Integrated circuit package-in-package system 2008-09-30
7407080 Wire bond capillary tip Kenny Lee, Hun Teak Lee, ChulSik Kim, Ki Youn Jang 2008-08-05
7298052 Micro chip-scale-package system Hun Teak Lee, Jason Lee 2007-11-20
7271496 Integrated circuit package-in-package system 2007-09-18
7254757 Flash memory test system and method capable of test time reduction Dong-Kyoo Park, Jeong-Ho Bang, Sang Young Choi, Eun Sik Kim 2007-08-07
6637970 Connector for prefabricated structures Soung-Soo Lim 2003-10-28
6040462 Calix[4 ]arene dibenzo crown ethers, their preparation process and their use for the selective extraction of cesium ion Won-Zin Oh, Kune Woo Lee, Wang Kyu Choi, Hyun Soo Park, Jong Seung Kim +1 more 2000-03-21
5157450 Apparatus for reversely turning copied sheets for a copying machine 1992-10-20