Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11063346 | Shark fin antenna for vehicle | Tae-Hoon Yang, Sang-hoon Lim, Soo Young Hwang, Ki Seok Uhm, Kyu Chang Nam +1 more | 2021-07-13 |
| 10391518 | Method for manufacturing transparent pattern print steel plate | Jin Tae Kim, Jong-Sang Kim, Bong-Woo Ha, Yang-Ho Choi, Jung Hwan Lee +1 more | 2019-08-27 |
| 10056321 | Semiconductor package and method for routing the package | Heung-Kyu Kwon | 2018-08-21 |
| 9349713 | Semiconductor package stack structure having interposer substrate | Byoung Wook Jang | 2016-05-24 |
| 9129826 | Epoxy bump for overhang die | Hun Teak Lee, Chul-Sik Kim, Ki Youn Jang | 2015-09-08 |
| 8519517 | Semiconductor system with fine pitch lead fingers and method of manufacturing thereof | Hun Teak Lee, ChulSik Kim, Ki Youn Jang | 2013-08-27 |
| 8256660 | Semiconductor package system with fine pitch lead fingers and method of manufacturing thereof | Hun Teak Lee, ChulSik Kim, Ki Youn Jang | 2012-09-04 |
| 8129263 | Wire bond interconnection and method of manufacture thereof | Hun Teak Lee, Chul-Sik Kim, Ki Youn Jang, Rajendra D. Pendse | 2012-03-06 |
| 7986047 | Wire bond interconnection | Hun Teak Lee, Chul-Sik Kim, Ki Youn Jang, Rajendra D. Pendse | 2011-07-26 |
| 7928435 | Interposer chip and multi-chip package having the interposer chip | Sung Yong Park, Tae-Je Cho, Tae Hun Kim, Byeong-Yeon Cho | 2011-04-19 |
| 7909233 | Method of manufacturing a semiconductor package with fine pitch lead fingers | Hun Teak Lee, ChulSik Kim, Ki Youn Jang | 2011-03-22 |
| 7745322 | Wire bond interconnection | Hun Teak Lee, Chul-Sik Kim, Ki Youn Jang, Rajendra D. Pendse | 2010-06-29 |
| 7731078 | Semiconductor system with fine pitch lead fingers | Hun Teak Lee, ChulSik Kim, Ki Youn Jang | 2010-06-08 |
| 7652382 | Micro chip-scale-package system | Hun Teak Lee, Jason Lee | 2010-01-26 |
| 7453156 | Wire bond interconnection | Hun Teak Lee, Chul-Sik Kim, Ki Youn Jang, Rajendra D. Pendse | 2008-11-18 |
| 7429798 | Integrated circuit package-in-package system | — | 2008-09-30 |
| 7407080 | Wire bond capillary tip | Kenny Lee, Hun Teak Lee, ChulSik Kim, Ki Youn Jang | 2008-08-05 |
| 7298052 | Micro chip-scale-package system | Hun Teak Lee, Jason Lee | 2007-11-20 |
| 7271496 | Integrated circuit package-in-package system | — | 2007-09-18 |
| 7254757 | Flash memory test system and method capable of test time reduction | Dong-Kyoo Park, Jeong-Ho Bang, Sang Young Choi, Eun Sik Kim | 2007-08-07 |
| 6637970 | Connector for prefabricated structures | Soung-Soo Lim | 2003-10-28 |
| 6040462 | Calix[4 ]arene dibenzo crown ethers, their preparation process and their use for the selective extraction of cesium ion | Won-Zin Oh, Kune Woo Lee, Wang Kyu Choi, Hyun Soo Park, Jong Seung Kim +1 more | 2000-03-21 |
| 5157450 | Apparatus for reversely turning copied sheets for a copying machine | — | 1992-10-20 |