Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145603 | Integrated circuit packaging system with shielding and method of manufacture thereof | Byung Joon Han, Il Kwon Shim, KyoungHee Park, Yaojian Lin, KyoWang Koo +5 more | 2021-10-12 |
| 11024585 | Integrated circuit packaging system with shielding and method of manufacture thereof | Byung Joon Han, Il Kwon Shim, KyoungHee Park, Yaojian Lin, KyoWang Koo +5 more | 2021-06-01 |
| 9997468 | Integrated circuit packaging system with shielding and method of manufacturing thereof | Byung Joon Han, Il Kwon Shim, KyoungHee Park, Yaojian Lin, KyoWang Koo +5 more | 2018-06-12 |
| 9693455 | Integrated circuit packaging system with plated copper posts and method of manufacture thereof | Seong Won Park, WoonJae Beak, Minjung Kim, Changhwan Kim, ByungHyun Kwak +2 more | 2017-06-27 |
| 9385100 | Integrated circuit packaging system with surface treatment and method of manufacture thereof | YoungChul Kim, Hyunll Bae, HeeSoo Lee, HeeJo Chi | 2016-07-05 |
| 9129826 | Epoxy bump for overhang die | Jong Kook Kim, Chul-Sik Kim, Ki Youn Jang | 2015-09-08 |
| 9093278 | Method of manufacture of integrated circuit packaging system with plasma processing | JoonYoung Choi, Seong Won Park, KyungOe Kim, SungWon Cho | 2015-07-28 |
| 8729687 | Stackable integrated circuit package system | Tae Keun Lee, Soo Jung Park | 2014-05-20 |
| 8716108 | Integrated circuit packaging system with ultra-thin chip and method of manufacture thereof | DaeWook Yang, Yeongbeom Ko | 2014-05-06 |
| 8519517 | Semiconductor system with fine pitch lead fingers and method of manufacturing thereof | Jong Kook Kim, ChulSik Kim, Ki Youn Jang | 2013-08-27 |
| 8410594 | Inter-stacking module system | Kwang Soon Hwang, Youngcheol Kim, Koo Hong Lee | 2013-04-02 |
| 8304874 | Stackable integrated circuit package system | Tae Keun Lee, Soo Jung Park | 2012-11-06 |
| 8269356 | Wire bonding structure and method that eliminates special wire bondable finish and reduces bonding pitch on substrates | Rajendra D. Pendse, Byung Joon Han | 2012-09-18 |
| 8256660 | Semiconductor package system with fine pitch lead fingers and method of manufacturing thereof | Jong Kook Kim, ChulSik Kim, Ki Youn Jang | 2012-09-04 |
| 8129263 | Wire bond interconnection and method of manufacture thereof | Jong Kook Kim, Chul-Sik Kim, Ki Youn Jang, Rajendra D. Pendse | 2012-03-06 |
| 7986047 | Wire bond interconnection | Jong Kook Kim, Chul-Sik Kim, Ki Youn Jang, Rajendra D. Pendse | 2011-07-26 |
| 7909233 | Method of manufacturing a semiconductor package with fine pitch lead fingers | Jong Kook Kim, ChulSik Kim, Ki Youn Jang | 2011-03-22 |
| 7863737 | Integrated circuit package system with wire bond pattern | Byoung Wook Jang, Kwang Soon Hwang | 2011-01-04 |
| 7759783 | Integrated circuit package system employing thin profile techniques | Tae Keun Lee, Soo Jung Park | 2010-07-20 |
| 7745322 | Wire bond interconnection | Jong Kook Kim, Chul-Sik Kim, Ki Youn Jang, Rajendra D. Pendse | 2010-06-29 |
| 7731078 | Semiconductor system with fine pitch lead fingers | Jong Kook Kim, ChulSik Kim, Ki Youn Jang | 2010-06-08 |
| 7652382 | Micro chip-scale-package system | Jong Kook Kim, Jason Lee | 2010-01-26 |
| 7453156 | Wire bond interconnection | Jong Kook Kim, Chul-Sik Kim, Ki Youn Jang, Rajendra D. Pendse | 2008-11-18 |
| 7407080 | Wire bond capillary tip | Kenny Lee, Jong Kook Kim, ChulSik Kim, Ki Youn Jang | 2008-08-05 |
| 7298052 | Micro chip-scale-package system | Jong Kook Kim, Jason Lee | 2007-11-20 |