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TaeKeun Lee, Youngmin Kim, Yongmin Kim |
2024-10-22 |
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NamJu Cho, Haengcheol Choi |
2024-09-24 |
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Semiconductor device and method of compartment shielding using bond wires |
ChoonHeung Lee, WonGyou Kim |
2024-06-11 |
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Motor including tension member |
Hoecheon Kim, Gun Ho Lee |
2023-09-26 |
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Semiconductor device and method of integrating RF antenna interposer with semiconductor package |
NamJu Cho, Haengcheol Choi |
2023-08-22 |
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Semiconductor device and method of forming hybrid TIM layers |
TaeKeun Lee, Youngmin Kim, Yongmin Kim |
2023-08-22 |
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Semiconductor device and method of compartment shielding using bond wires |
ChoonHeung Lee, WonGyou Kim |
2022-09-20 |
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Filp chip interconnection structure with bump on partial pad and method thereof |
Rajendra D. Pendse, TaeKeun Lee, GuiChea Na, Gwangjin Kim |
2015-09-01 |
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Integrated circuit package system with mold gate |
DaeWook Yang, Tae Keun Lee |
2014-09-23 |
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Integrated circuit packaging system with reinforced encapsulant having embedded interconnect and method of manufacture thereof |
Seng Guan Chow, Il Kwon Shim, Heap Hoe Kuan |
2013-12-10 |
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Thin package system with external terminals and method of manufacture thereof |
Myung Kil Lee, Gwang Kim, Koo Hong Lee |
2013-07-09 |
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Inter-stacking module system |
Kwang Soon Hwang, Hun Teak Lee, Koo Hong Lee |
2013-04-02 |
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Stacked integrated circuit and package system and method for manufacturing thereof |
Tae Sung Jeong, Hyeog Chan Kwon |
2012-01-24 |
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Thin package system with external terminals |
Myung Kil Lee, Gwang Kim, Koo Hong Lee |
2011-05-24 |
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Stacked integrated circuit and package system |
Tae Sung Jeong, Hyeog Chan Kwon |
2011-01-25 |
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Method for making semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package |
Marcos Karnezos, Flynn Carson |
2010-11-09 |
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Flip chip interconnection structure with bump on partial pad and method thereof |
Rajendra D. Pendse, TaeKeun Lee, GuiChea Na, Gwangjin Kim |
2010-07-20 |
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Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package |
Marcos Karnezos, Flynn Carson |
2010-04-06 |
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Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package |
Marcos Karnezos, Flynn Carson |
2007-08-07 |