Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12362287 | Semiconductor device and method of making double shielding layers over the semiconductor device | ChangOh Kim, JinHee Jung | 2025-07-15 |
| 12218114 | Semiconductor device and method of making a photonic semiconductor package | KyungOe Kim, HeeSoo Lee | 2025-02-04 |
| 12125764 | Semiconductor device and method of forming hybrid TIM layers | TaeKeun Lee, Youngmin Kim, Yongmin Kim | 2024-10-22 |
| 12100663 | Semiconductor device and method of integrating RF antenna interposer with semiconductor package | NamJu Cho, Haengcheol Choi | 2024-09-24 |
| 12009314 | Semiconductor device and method of compartment shielding using bond wires | ChoonHeung Lee, WonGyou Kim | 2024-06-11 |
| 11770046 | Motor including tension member | Hoecheon Kim, Gun Ho Lee | 2023-09-26 |
| 11735530 | Semiconductor device and method of integrating RF antenna interposer with semiconductor package | NamJu Cho, Haengcheol Choi | 2023-08-22 |
| 11735489 | Semiconductor device and method of forming hybrid TIM layers | TaeKeun Lee, Youngmin Kim, Yongmin Kim | 2023-08-22 |
| 11450618 | Semiconductor device and method of compartment shielding using bond wires | ChoonHeung Lee, WonGyou Kim | 2022-09-20 |
| 9125332 | Filp chip interconnection structure with bump on partial pad and method thereof | Rajendra D. Pendse, TaeKeun Lee, GuiChea Na, Gwangjin Kim | 2015-09-01 |
| 8841782 | Integrated circuit package system with mold gate | DaeWook Yang, Tae Keun Lee | 2014-09-23 |
| 8604602 | Integrated circuit packaging system with reinforced encapsulant having embedded interconnect and method of manufacture thereof | Seng Guan Chow, Il Kwon Shim, Heap Hoe Kuan | 2013-12-10 |
| 8481371 | Thin package system with external terminals and method of manufacture thereof | Myung Kil Lee, Gwang Kim, Koo Hong Lee | 2013-07-09 |
| 8410594 | Inter-stacking module system | Kwang Soon Hwang, Hun Teak Lee, Koo Hong Lee | 2013-04-02 |
| 8102043 | Stacked integrated circuit and package system and method for manufacturing thereof | Tae Sung Jeong, Hyeog Chan Kwon | 2012-01-24 |
| 7947535 | Thin package system with external terminals | Myung Kil Lee, Gwang Kim, Koo Hong Lee | 2011-05-24 |
| 7875966 | Stacked integrated circuit and package system | Tae Sung Jeong, Hyeog Chan Kwon | 2011-01-25 |
| 7829382 | Method for making semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package | Marcos Karnezos, Flynn Carson | 2010-11-09 |
| 7759137 | Flip chip interconnection structure with bump on partial pad and method thereof | Rajendra D. Pendse, TaeKeun Lee, GuiChea Na, Gwangjin Kim | 2010-07-20 |
| 7692279 | Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package | Marcos Karnezos, Flynn Carson | 2010-04-06 |
| 7253511 | Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package | Marcos Karnezos, Flynn Carson | 2007-08-07 |