Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9768102 | Integrated circuit packaging system with support structure and method of manufacture thereof | Dong Ju Jeon, Sung-Soo Kim | 2017-09-19 |
| 8710675 | Integrated circuit package system with bonding lands | Young Cheol Kim | 2014-04-29 |
| 8481371 | Thin package system with external terminals and method of manufacture thereof | Youngcheol Kim, Myung Kil Lee, Gwang Kim | 2013-07-09 |
| 8471374 | Integrated circuit package system with L-shaped leadfingers | Young Cheol Kim, Jae Hak Yee | 2013-06-25 |
| 8432026 | Stackable multi-chip package system | Jae Hak Yee | 2013-04-30 |
| 8410594 | Inter-stacking module system | Kwang Soon Hwang, Youngcheol Kim, Hun Teak Lee | 2013-04-02 |
| 8125076 | Semiconductor package system with substrate heat sink | Gwang Kim | 2012-02-28 |
| 8067272 | Integrated circuit package system for package stacking and manufacturing method thereof | Young Cheol Kim, Jae Hak Yee, II Kwon Shim | 2011-11-29 |
| 8026582 | Integrated circuit package system with internal stacking module adhesive | Myung Kil Lee, Jae-Chang Kim | 2011-09-27 |
| 8012867 | Wafer level chip scale package system | Il Kwon Shim, Young Cheol Kim, Bongsuk Choi | 2011-09-06 |
| 7947535 | Thin package system with external terminals | Youngcheol Kim, Myung Kil Lee, Gwang Kim | 2011-05-24 |
| 7915738 | Stackable multi-chip package system with support structure | Young Cheol Kim, Jae Hak Yee | 2011-03-29 |
| 7915724 | Integrated circuit packaging system with base structure device | Jong-Woo Ha, Soo Won Lee, Juhyun Park, Zigmund Ramirez Camacho, Jeffrey D. Punzalan +2 more | 2011-03-29 |
| 7736950 | Flip chip interconnection | Rajendra D. Pendse, Marcos Karnezos, Kyung-Moon Kim, Moon Hee Lee, Orion K. Starr | 2010-06-15 |
| 7683467 | Integrated circuit package system employing structural support | Byoung Wook Jang, Young Cheol Kim | 2010-03-23 |
| 7645638 | Stackable multi-chip package system with support structure | Young Cheol Kim, Jae Hak Yee | 2010-01-12 |
| 7622333 | Integrated circuit package system for package stacking and manufacturing method thereof | Young Cheol Kim, Jae Hak Yee, Il Kwon Shim | 2009-11-24 |
| 7521297 | Multichip package system | Seongmin Lee, SeungYun Ahn | 2009-04-21 |
| 6661083 | Plastic semiconductor package | Sang Don Lee, Flynn Carson, Ki Tae Ryu | 2003-12-09 |