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Home › Chippac › Marcos Karnezos

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Marcos Karnezos — 68 Patents

CHChippac: 43 patents #1 of 42Top 3%

SCStats Chippac: 13 patents #84 of 425Top 20%

SISignetics: 3 patents #5 of 93Top 6%

HP: 3 patents #5,824 of 7,018Top 85%

A-A-Sat: 2 patents #19 of 49Top 40%

VAVarian: 1 patents #283 of 684Top 45%

Palo Alto, CA: #220 of 9,675 inventorsTop 3%

California: #4,714 of 386,348 inventorsTop 2%

Overall (All Time): #30,786 of 4,157,543Top 1%

68 Patents All Time

Marcos Karnezos has been granted 68 US patents while listed as an inventor at Chippac. The first was granted in 1986 and the most recent in March 2015. Marcos Karnezos ranks #30,786 of 4,157,543 US inventors in our database (top 0.74%). Patent records list Marcos Karnezos in Palo Alto, CA, US.

Patents per Year

Issued Patents All Time

Showing 1–25 of 68 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
8994162	Semiconductor multi-package module including tape substrate land grid array package stacked over ball grid array package	—	2015-03-31
8970049	Multiple chip package module having inverted package stacked over die	—	2015-03-03
8552551	Adhesive/spacer island structure for stacking over wire bonded die	Sang Ho Lee, Jong Wook Ju, Hyeog Chan Kwon	2013-10-08
8410596	Semiconductor multi-package module including tape substrate land grid array package stacked over ball grid array package	—	2013-04-02
8143100	Method of fabricating a semiconductor multi-package module having wire bond interconnect between stacked packages	—	2012-03-27
8030134	Stacked semiconductor package having adhesive/spacer structure and insulation	Hyeog Chan Kwon	2011-10-04
8030756	Plastic ball grid array package with integral heatsink	TaeKeun Lee, Flynn Carson	2011-10-04
7935572	Semiconductor multi-package module having package stacked over die-up flip chip ball grid array package and having wire bond interconnect between stacked packages	—	2011-05-03
7923822	Integrated circuit package system including shield	—	2011-04-12
7829382	Method for making semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package	Flynn Carson, Youngcheol Kim	2010-11-09
7749807	Method of fabricating a semiconductor multipackage module including a processor and memory package assemblies	—	2010-07-06
7736950	Flip chip interconnection	Rajendra D. Pendse, Kyung-Moon Kim, Koo Hong Lee, Moon Hee Lee, Orion K. Starr	2010-06-15
7732254	Semiconductor multi-package module having package stacked over die-up flip chip ball grid array package and having wire bond interconnect between stacked packages	—	2010-06-08
7728417	Integrated circuit package system including shield	—	2010-06-01
7692279	Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package	Flynn Carson, Youngcheol Kim	2010-04-06
7687313	Method of fabricating a semiconductor multi package module having an inverted package stacked over ball grid array (BGA) package	—	2010-03-30
7682873	Semiconductor multi-package module having package stacked over die-down flip chip ball grid array package and having wire bond interconnect between stacked packages	—	2010-03-23
7645634	Method of fabricating module having stacked chip scale semiconductor packages	—	2010-01-12
7638363	Semiconductor multi-package module having package stacked over ball grid array package and having wire bond interconnect between stacked packages	—	2009-12-29
7589407	Semiconductor multipackage module including tape substrate land grid array package stacked over ball grid array package	—	2009-09-15
7582960	Multiple chip package module including die stacked over encapsulated package	—	2009-09-01
7494847	Method for making a semiconductor multi-package module having inverted wire bond carrier second package	Flynn Carson	2009-02-24
7429786	Semiconductor package including second substrate and having exposed substrate surfaces on upper and lower sides	Flynn Carson	2008-09-30
7429787	Semiconductor assembly including chip scale package and second substrate with exposed surfaces on upper and lower sides	Il Kwon Shim, Byung Joon Han, Kambhampati Ramakrishna, Seng Guan Chow	2008-09-30
7394148	Module having stacked chip scale semiconductor packages	—	2008-07-01