Issued Patents All Time
Showing 25 most recent of 68 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8994162 | Semiconductor multi-package module including tape substrate land grid array package stacked over ball grid array package | — | 2015-03-31 |
| 8970049 | Multiple chip package module having inverted package stacked over die | — | 2015-03-03 |
| 8552551 | Adhesive/spacer island structure for stacking over wire bonded die | Sang Ho Lee, Jong Wook Ju, Hyeog Chan Kwon | 2013-10-08 |
| 8410596 | Semiconductor multi-package module including tape substrate land grid array package stacked over ball grid array package | — | 2013-04-02 |
| 8143100 | Method of fabricating a semiconductor multi-package module having wire bond interconnect between stacked packages | — | 2012-03-27 |
| 8030134 | Stacked semiconductor package having adhesive/spacer structure and insulation | Hyeog Chan Kwon | 2011-10-04 |
| 8030756 | Plastic ball grid array package with integral heatsink | TaeKeun Lee, Flynn Carson | 2011-10-04 |
| 7935572 | Semiconductor multi-package module having package stacked over die-up flip chip ball grid array package and having wire bond interconnect between stacked packages | — | 2011-05-03 |
| 7923822 | Integrated circuit package system including shield | — | 2011-04-12 |
| 7829382 | Method for making semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package | Flynn Carson, Youngcheol Kim | 2010-11-09 |
| 7749807 | Method of fabricating a semiconductor multipackage module including a processor and memory package assemblies | — | 2010-07-06 |
| 7736950 | Flip chip interconnection | Rajendra D. Pendse, Kyung-Moon Kim, Koo Hong Lee, Moon Hee Lee, Orion K. Starr | 2010-06-15 |
| 7732254 | Semiconductor multi-package module having package stacked over die-up flip chip ball grid array package and having wire bond interconnect between stacked packages | — | 2010-06-08 |
| 7728417 | Integrated circuit package system including shield | — | 2010-06-01 |
| 7692279 | Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package | Flynn Carson, Youngcheol Kim | 2010-04-06 |
| 7687313 | Method of fabricating a semiconductor multi package module having an inverted package stacked over ball grid array (BGA) package | — | 2010-03-30 |
| 7682873 | Semiconductor multi-package module having package stacked over die-down flip chip ball grid array package and having wire bond interconnect between stacked packages | — | 2010-03-23 |
| 7645634 | Method of fabricating module having stacked chip scale semiconductor packages | — | 2010-01-12 |
| 7638363 | Semiconductor multi-package module having package stacked over ball grid array package and having wire bond interconnect between stacked packages | — | 2009-12-29 |
| 7589407 | Semiconductor multipackage module including tape substrate land grid array package stacked over ball grid array package | — | 2009-09-15 |
| 7582960 | Multiple chip package module including die stacked over encapsulated package | — | 2009-09-01 |
| 7494847 | Method for making a semiconductor multi-package module having inverted wire bond carrier second package | Flynn Carson | 2009-02-24 |
| 7429786 | Semiconductor package including second substrate and having exposed substrate surfaces on upper and lower sides | Flynn Carson | 2008-09-30 |
| 7429787 | Semiconductor assembly including chip scale package and second substrate with exposed surfaces on upper and lower sides | Il Kwon Shim, Byung Joon Han, Kambhampati Ramakrishna, Seng Guan Chow | 2008-09-30 |
| 7394148 | Module having stacked chip scale semiconductor packages | — | 2008-07-01 |