Issued Patents All Time
Showing 26–50 of 68 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7372141 | Semiconductor stacked package assembly having exposed substrate surfaces on upper and lower sides | Il Kwon Shim, Byung Joon Han, Kambhampati Ramakrishna, Seng Guan Chow | 2008-05-13 |
| 7364946 | Method of fabricating a semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) package | — | 2008-04-29 |
| 7358115 | Method of fabricating a semiconductor assembly including chip scale package and second substrate with exposed substrate surfaces on upper and lower sides | — | 2008-04-15 |
| 7351610 | Method of fabricating a semiconductor multi-package module having a second package substrate with an exposed metal layer wire bonded to a first package substrate | — | 2008-04-01 |
| 7306973 | Method for making a semiconductor multipackage module including a processor and memory package assemblies | — | 2007-12-11 |
| 7288434 | Method for making semiconductor multi-package module having inverted second package and including additional die or package stacked on second package | — | 2007-10-30 |
| 7279361 | Method for making a semiconductor multi-package module having wire bond interconnect between stacked packages | — | 2007-10-09 |
| 7253511 | Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package | Flynn Carson, Youngcheol Kim | 2007-08-07 |
| 7247519 | Method for making a semiconductor multi-package module having inverted bump chip carrier second package | Flynn Carson | 2007-07-24 |
| 7217598 | Method for manufacturing plastic ball grid array package with integral heatsink | TaeKeun Lee, Flynn Carson | 2007-05-15 |
| 7205647 | Semiconductor multi-package module having package stacked over ball grid array package and having wire bond interconnect between stacked packages | — | 2007-04-17 |
| 7169642 | Method of fabricating a semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) package | — | 2007-01-30 |
| 7166494 | Method of fabricating a semiconductor stacked multi-package module having inverted second package | — | 2007-01-23 |
| 7163842 | Method of fabricating a semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) | — | 2007-01-16 |
| 7101731 | Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package | — | 2006-09-05 |
| 7064426 | Semiconductor multi-package module having wire bond interconnect between stacked packages | — | 2006-06-20 |
| 7061088 | Semiconductor stacked multi-package module having inverted second package | — | 2006-06-13 |
| 7057269 | Semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) package | — | 2006-06-06 |
| 7053476 | Semiconductor multi-package module having package stacked over die-down flip chip ball grid array package and having wire bond interconnect between stacked packages | — | 2006-05-30 |
| 7053477 | Semiconductor multi-package module having inverted bump chip carrier second package | Flynn Carson | 2006-05-30 |
| 7049691 | Semiconductor multi-package module having inverted second package and including additional die or stacked package on second package | — | 2006-05-23 |
| 7045887 | Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package | — | 2006-05-16 |
| 7034387 | Semiconductor multipackage module including processor and memory package assemblies | — | 2006-04-25 |
| 6972481 | Semiconductor multi-package module including stacked-die package and having wire bond interconnect between stacked packages | — | 2005-12-06 |
| 6967126 | Method for manufacturing plastic ball grid array with integral heatsink | TaeKeun Lee, Flynn Carson | 2005-11-22 |