Issued Patents All Time
Showing 25 most recent of 207 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12080600 | Semiconductor device and method to minimize stress on stack via | Yaojian Lin | 2024-09-03 |
| RE48408 | Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect | Reza A. Pagaila, Seung Uk Yoon, Byung Tai Do, Linda Pei Ee Chua | 2021-01-26 |
| 10804153 | Semiconductor device and method to minimize stress on stack via | Yaojian Lin | 2020-10-13 |
| RE48111 | Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect | Reza A. Pagaila, Seung Uk Yoon, Byung Tai Do, Linda Pei Ee Chua | 2020-07-21 |
| 10297556 | Semiconductor device and method of controlling warpage in reconstituted wafer | Kian Meng Heng, Hin Hwa Goh, Jose Alvin Caparas, Kang Chen, Yaojian Lin | 2019-05-21 |
| 10163747 | Semiconductor device and method of controlling warpage in reconstituted wafer | Kian Meng Heng, Hin Hwa Goh, Jose Alvin Caparas, Kang Chen, Yaojian Lin | 2018-12-25 |
| 10083916 | Semiconductor device and method of forming stress relief layer between die and interconnect structure | Il Kwon Shim, Yaojian Yaojian | 2018-09-25 |
| 9893045 | Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect | Reza A. Pagaila, Seung Uk Yoon, Byung Tai Do, Linda Pei Ee Chua | 2018-02-13 |
| 9847253 | Package-on-package using through-hole via die on saw streets | Byung Tai Do, Heap Hoe Kuan | 2017-12-19 |
| 9666500 | Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief | Yaojian Lin, Pandi C. Marimuthu, Kang Chen, Hin Hwa Goh, Yu Gu +4 more | 2017-05-30 |
| 9620557 | Semiconductor device and method of forming EWLB semiconductor package with vertical interconnect structure and cavity region | Lee Sun Lim, Rui Huang, Xu Sheng Bao, Ma Phoo Pwint Hlaing | 2017-04-11 |
| 9607965 | Semiconductor device and method of controlling warpage in reconstituted wafer | Kian Meng Heng, Hin Hwa Goh, Jose Alvin Caparas, Kang Chen, Yaojian Lin | 2017-03-28 |
| 9559029 | Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer | Il Kwon Shim, Yaojian Lin | 2017-01-31 |
| 9524955 | Semiconductor device and method of forming no-flow underfill material around vertical interconnect structure | Rui Huang, Heap Hoe Kuan, Yaojian Lin | 2016-12-20 |
| 9524938 | Package-in-package using through-hole via die on saw streets | Byung Tai Do, Heap Hoe Kuan | 2016-12-20 |
| 9515016 | Semiconductor package and method of forming z-direction conductive posts embedded in structurally protective encapsulant | Rui Huang, Il Kwon Shim, Heap Hoe Kuan | 2016-12-06 |
| 9508621 | Semiconductor device and method of forming compliant stress relief buffer around large array WLCSP | Yaojian Lin, Il Kwon Shim | 2016-11-29 |
| 9299648 | Integrated circuit packaging system with patterned substrate and method of manufacture thereof | Il Kwon Shim, Heap Hoe Kuan | 2016-03-29 |
| 9293350 | Semiconductor package system with cavity substrate and manufacturing method therefor | Rui Huang, Heap Hoe Kuan | 2016-03-22 |
| 9275877 | Semiconductor device and method of forming semiconductor package using panel form carrier | Yaojian Lin, Rui Huang, Heap Hoe Kuan | 2016-03-01 |
| 9257356 | Semiconductor device and method of forming an IPD beneath a semiconductor die with direct connection to external devices | Rui Huang, Heap Hoe Kuan, Yaojian Lin | 2016-02-09 |
| 9252066 | Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer | Il Kwon Shim, Yaojian Lin | 2016-02-02 |
| 9252172 | Semiconductor device and method of forming EWLB semiconductor package with vertical interconnect structure and cavity region | Lee Sun Lim, Rui Huang, Xusheng Bao, Ma Phoo Pwint Hlaing | 2016-02-02 |
| 9240380 | Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect | Reza A. Pagaila, Seung Uk Yoon | 2016-01-19 |
| 9202777 | Semiconductor package system with cut multiple lead pads | Lionel Chien Hui Tay, Zigmund Ramirez Camacho | 2015-12-01 |