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ZC

Zigmund Ramirez Camacho — 220 Patents

SCStats Chippac: 216 patents #3 of 425Top 1%

JCJcet Semiconductor (Shaoxing) Co.: 1 patents #18 of 38Top 50%

SESemtech: 1 patents #103 of 201Top 55%

SSSt Assembly Test Services: 1 patents #36 of 63Top 60%

Overall (All Time): #2,729 of 4,157,543Top 1%

220 Patents All Time

Zigmund Ramirez Camacho has been granted 220 US patents while listed as an inventor at Stats Chippac. The first was granted in 2004 and the most recent in October 2022. Zigmund Ramirez Camacho ranks #2,729 of 4,157,543 US inventors in our database (top 0.07%). Patent records list Zigmund Ramirez Camacho in Singapore, CO, SG.

Patents per Year

Issued Patents All Time

Showing 1–25 of 220 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
11469149	Semiconductor device and method of forming mold degating structure for pre-molded substrate	Henry Descalzo Bathan	2022-10-11	$8,147,000
10651139	Semiconductor device and method of forming wafer level ground plane and power ring	Guruprasad G. Badakere, Lionel Chien Hui Tay	2020-05-12
RE47923	Semiconductor device and method of forming PIP with inner known good die interconnected with conductive bumps	Frederick R. Dahilig, Lionel Chien Hui Tay, Arnel Senosa Trasporto, Henry Descalzo Bathan	2020-03-31
9922955	Semiconductor device and method of forming package-on-package structure electrically interconnected through TSV in WLCSP	Dioscoro A. Merilo, Lionel Chien Hui Tay	2018-03-20
9865554	Integrated circuit packaging system with under bump metallization and method of manufacture thereof	Il Kwon Shim, Kyung-Moon Kim, HeeJo Chi, JunMo Koo, Bartholomew Liao Chung Foh	2018-01-09
9721925	Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure	Henry Descalzo Bathan, Jairus Legaspi Pisigan	2017-08-01
9679769	Integrated circuit packaging system with photoimagable dielectric-defined trace and method of manufacture thereof	Bartholomew Liao Chung Foh, Sheila Marie L. Alvarez, Dao Nguyen Phu Cuong, HeeJo Chi	2017-06-13
9666540	Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die	Frederick R. Dahilig, Lionel Chien Hui Tay, Dioscoro A. Merilo	2017-05-30
9659897	Integrated circuit packaging system with interposer structure and method of manufacture thereof	Emmanuel Espiritu, Bartholomew Liao Chung Foh, Dao Nguyen Phu Cuong, Jeffrey D. Punzalan	2017-05-23
9589876	Semiconductor device and method of forming a wafer level package with top and bottom solder bump interconnection	Lionel Chien Hui Tay, Henry Descalzo Bathan, Dioscoro A. Merilo, Jeffrey D. Punzalan	2017-03-07
9525080	Semiconductor device with optical sensor and method of forming interconnect structure on front and backside of the device	Henry Descalzo Bathan, Lionel Chien Hui Tay, Arnel Senosa Trasporto	2016-12-20
9502267	Integrated circuit packaging system with support structure and method of manufacture thereof	HeeJo Chi, Bartholomew Liao Chung Foh, Sheila Marie L. Alvarez, Dao Nguyen Phu Cuong	2016-11-22
9472427	Semiconductor device and method of forming leadframe with notched fingers for stacking semiconductor die	Henry Descalzo Bathan, Jairus Legaspi Pisigan	2016-10-18
9406642	Integrated circuit packaging system with insulated trace and method of manufacture thereof	HeeJo Chi, Bartholomew Liao Chung Foh, Sheila Marie L. Alvarez, Dao Nguyen Phu Cuong	2016-08-02
9406531	Integrated circuit packaging system with photoimagable dielectric-defined trace and method of manufacture thereof	Bartholomew Liao Chung Foh, Sheila Marie L. Alvarez, Dao Nguyen Phu Cuong, HeeJo Chi	2016-08-02
9397236	Optical semiconductor device having pre-molded leadframe with window and method therefor	Henry Descalzo Bathan, Lionel Chien Hui Tay, Arnel Senosa Trasporto	2016-07-19
9390991	Semiconductor device and method of forming wafer level ground plane and power ring	Guruprasad G. Badakere, Lionel Chien Hui Tay	2016-07-12
9355983	Integrated circuit packaging system with interposer structure and method of manufacture thereof	Emmanuel Espiritu, Bartholomew Liao Chung Foh, Dao Nguyen Phu Cuong, Jeffrey D. Punzalan	2016-05-31
9337161	Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof	Dioscoro A. Merilo, Henry Descalzo Bathan, Lionel Chien Hui Tay	2016-05-10
9330994	Semiconductor device and method of forming RDL and vertical interconnect by laser direct structuring	Bartholomew Liao, Sheila Marie L. Alvarez, HeeJo Chi, Kelvin Dao	2016-05-03
9331003	Integrated circuit packaging system with pre-molded leadframe and method of manufacture thereof	Bartholomew Liao Chung Foh, Sheila Marie L. Alvarez, Dao Nguyen Phu Cuong, HeeJo Chi	2016-05-03
9324673	Integrated circuit packaging system with wafer level reconfiguration and method of manufacture thereof	—	2016-04-26
9299644	Integrated circuit packaging system with routed circuit lead array and method of manufacture thereof	Byung Tai Do, Arnel Senosa Trasporto	2016-03-29
9257357	Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die	Frederick R. Dahilig, Lionel Chien Hui Tay, Dioscoro A. Merilo	2016-02-09
9252075	Semiconductor device and method of forming a conductive via-in-via structure	Lionel Chien Hui Tay, Jianmin Fang	2016-02-02