Issued Patents All Time
Showing 25 most recent of 220 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11469149 | Semiconductor device and method of forming mold degating structure for pre-molded substrate | Henry Descalzo Bathan | 2022-10-11 |
| 10651139 | Semiconductor device and method of forming wafer level ground plane and power ring | Guruprasad G. Badakere, Lionel Chien Hui Tay | 2020-05-12 |
| RE47923 | Semiconductor device and method of forming PIP with inner known good die interconnected with conductive bumps | Frederick R. Dahilig, Lionel Chien Hui Tay, Arnel Senosa Trasporto, Henry Descalzo Bathan | 2020-03-31 |
| 9922955 | Semiconductor device and method of forming package-on-package structure electrically interconnected through TSV in WLCSP | Dioscoro A. Merilo, Lionel Chien Hui Tay | 2018-03-20 |
| 9865554 | Integrated circuit packaging system with under bump metallization and method of manufacture thereof | Il Kwon Shim, Kyung-Moon Kim, HeeJo Chi, JunMo Koo, Bartholomew Liao Chung Foh | 2018-01-09 |
| 9721925 | Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure | Henry Descalzo Bathan, Jairus Legaspi Pisigan | 2017-08-01 |
| 9679769 | Integrated circuit packaging system with photoimagable dielectric-defined trace and method of manufacture thereof | Bartholomew Liao Chung Foh, Sheila Marie L. Alvarez, Dao Nguyen Phu Cuong, HeeJo Chi | 2017-06-13 |
| 9666540 | Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die | Frederick R. Dahilig, Lionel Chien Hui Tay, Dioscoro A. Merilo | 2017-05-30 |
| 9659897 | Integrated circuit packaging system with interposer structure and method of manufacture thereof | Emmanuel Espiritu, Bartholomew Liao Chung Foh, Dao Nguyen Phu Cuong, Jeffrey D. Punzalan | 2017-05-23 |
| 9589876 | Semiconductor device and method of forming a wafer level package with top and bottom solder bump interconnection | Lionel Chien Hui Tay, Henry Descalzo Bathan, Dioscoro A. Merilo, Jeffrey D. Punzalan | 2017-03-07 |
| 9525080 | Semiconductor device with optical sensor and method of forming interconnect structure on front and backside of the device | Henry Descalzo Bathan, Lionel Chien Hui Tay, Arnel Senosa Trasporto | 2016-12-20 |
| 9502267 | Integrated circuit packaging system with support structure and method of manufacture thereof | HeeJo Chi, Bartholomew Liao Chung Foh, Sheila Marie L. Alvarez, Dao Nguyen Phu Cuong | 2016-11-22 |
| 9472427 | Semiconductor device and method of forming leadframe with notched fingers for stacking semiconductor die | Henry Descalzo Bathan, Jairus Legaspi Pisigan | 2016-10-18 |
| 9406642 | Integrated circuit packaging system with insulated trace and method of manufacture thereof | HeeJo Chi, Bartholomew Liao Chung Foh, Sheila Marie L. Alvarez, Dao Nguyen Phu Cuong | 2016-08-02 |
| 9406531 | Integrated circuit packaging system with photoimagable dielectric-defined trace and method of manufacture thereof | Bartholomew Liao Chung Foh, Sheila Marie L. Alvarez, Dao Nguyen Phu Cuong, HeeJo Chi | 2016-08-02 |
| 9397236 | Optical semiconductor device having pre-molded leadframe with window and method therefor | Henry Descalzo Bathan, Lionel Chien Hui Tay, Arnel Senosa Trasporto | 2016-07-19 |
| 9390991 | Semiconductor device and method of forming wafer level ground plane and power ring | Guruprasad G. Badakere, Lionel Chien Hui Tay | 2016-07-12 |
| 9355983 | Integrated circuit packaging system with interposer structure and method of manufacture thereof | Emmanuel Espiritu, Bartholomew Liao Chung Foh, Dao Nguyen Phu Cuong, Jeffrey D. Punzalan | 2016-05-31 |
| 9337161 | Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof | Dioscoro A. Merilo, Henry Descalzo Bathan, Lionel Chien Hui Tay | 2016-05-10 |
| 9330994 | Semiconductor device and method of forming RDL and vertical interconnect by laser direct structuring | Bartholomew Liao, Sheila Marie L. Alvarez, HeeJo Chi, Kelvin Dao | 2016-05-03 |
| 9331003 | Integrated circuit packaging system with pre-molded leadframe and method of manufacture thereof | Bartholomew Liao Chung Foh, Sheila Marie L. Alvarez, Dao Nguyen Phu Cuong, HeeJo Chi | 2016-05-03 |
| 9324673 | Integrated circuit packaging system with wafer level reconfiguration and method of manufacture thereof | — | 2016-04-26 |
| 9299644 | Integrated circuit packaging system with routed circuit lead array and method of manufacture thereof | Byung Tai Do, Arnel Senosa Trasporto | 2016-03-29 |
| 9257357 | Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die | Frederick R. Dahilig, Lionel Chien Hui Tay, Dioscoro A. Merilo | 2016-02-09 |
| 9252075 | Semiconductor device and method of forming a conductive via-in-via structure | Lionel Chien Hui Tay, Jianmin Fang | 2016-02-02 |