Guruprasad G. Badakere — 7 Patents at Stats Chippac

Guruprasad G. Badakere has been granted 7 US patents while listed as an inventor at Stats Chippac. The first was granted in 2005 and the most recent in May 2020. Guruprasad G. Badakere ranks #680,018 of 4,157,543 US inventors in our database (top 16.4%). Patent records list Guruprasad G. Badakere in Singapore, SG.

Patents per Year

Issued Patents All Time

Showing 1–7 of 7 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
10651139	Semiconductor device and method of forming wafer level ground plane and power ring	Zigmund Ramirez Camacho, Lionel Chien Hui Tay	2020-05-12
9390991	Semiconductor device and method of forming wafer level ground plane and power ring	Zigmund Ramirez Camacho, Lionel Chien Hui Tay	2016-07-12
8097943	Semiconductor device and method of forming wafer level ground plane and power ring	Zigmund Ramirez Camacho, Lionel Chien Hui Tay	2012-01-17
7842607	Semiconductor device and method of providing a thermal dissipation path through RDL and conductive via	Lionel Chien Hui Tay, Zigmund Ramirez Camacho	2010-11-30
7838395	Semiconductor wafer level interconnect package utilizing conductive ring and pad for separate voltage supplies and method of making the same	Zigmund Ramirez Camacho, Lionel Chien Hui Tay	2010-11-23
6979907	Integrated circuit package	Jian Li, Il Kwon Shim	2005-12-27	$2,589,000
6855573	Integrated circuit package and manufacturing method therefor with unique interconnector	Jian Li, Il Kwon Shim	2005-02-15	$2,546,000