Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10651139 | Semiconductor device and method of forming wafer level ground plane and power ring | Zigmund Ramirez Camacho, Lionel Chien Hui Tay | 2020-05-12 |
| 9390991 | Semiconductor device and method of forming wafer level ground plane and power ring | Zigmund Ramirez Camacho, Lionel Chien Hui Tay | 2016-07-12 |
| 8097943 | Semiconductor device and method of forming wafer level ground plane and power ring | Zigmund Ramirez Camacho, Lionel Chien Hui Tay | 2012-01-17 |
| 7842607 | Semiconductor device and method of providing a thermal dissipation path through RDL and conductive via | Lionel Chien Hui Tay, Zigmund Ramirez Camacho | 2010-11-30 |
| 7838395 | Semiconductor wafer level interconnect package utilizing conductive ring and pad for separate voltage supplies and method of making the same | Zigmund Ramirez Camacho, Lionel Chien Hui Tay | 2010-11-23 |
| 6979907 | Integrated circuit package | Jian Li, Il Kwon Shim | 2005-12-27 |
| 6855573 | Integrated circuit package and manufacturing method therefor with unique interconnector | Jian Li, Il Kwon Shim | 2005-02-15 |