Issued Patents All Time
Showing 51–75 of 220 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8866248 | Semiconductor device with optical sensor and method of forming interconnect structure on front and backside of the device | Henry Descalzo Bathan, Lionel Chien Hui Tay, Arnel Senosa Trasporto | 2014-10-21 |
| 8810017 | Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof | Dioscoro A. Merilo, Henry Descalzo Bathan, Lionel Chien Hui Tay | 2014-08-19 |
| 8810015 | Integrated circuit packaging system with high lead count and method of manufacture thereof | Henry Descalzo Bathan, Frederick R. Dahilig | 2014-08-19 |
| 8802501 | Integrated circuit packaging system with island terminals and method of manufacture thereof | Henry Descalzo Bathan, Emmanuel Espiritu, Byung Tai Do, Arnel Senosa Trasporto, Linda Pei Ee Chua | 2014-08-12 |
| 8802505 | Semiconductor device and method of forming a protective layer on a backside of the wafer | Henry Descalzo Bathan, Jairus Legaspi Pisigan | 2014-08-12 |
| 8803300 | Integrated circuit packaging system with protective coating and method of manufacture thereof | Henry Descalzo Bathan, Emmanuel Espiritu, Jeffrey D. Punzalan | 2014-08-12 |
| 8802555 | Integrated circuit packaging system with interconnects and method of manufacture thereof | Henry Descalzo Bathan, Jairus Legaspi Pisigan, Rachel Layda Abinan | 2014-08-12 |
| 8786063 | Integrated circuit packaging system with leads and transposer and method of manufacture thereof | Henry Descalzo Bathan, Arnel Senosa Trasporto | 2014-07-22 |
| 8766428 | Integrated circuit packaging system with flip chip and method of manufacture thereof | Henry Descalzo Bathan, Jairus Legaspi Pisigan | 2014-07-01 |
| 8735224 | Integrated circuit packaging system with routed circuit lead array and method of manufacture thereof | Byung Tai Do, Arnel Senosa Trasporto | 2014-05-27 |
| 8729693 | Integrated circuit packaging system with a leaded package and method of manufacture thereof | Arnel Senosa Trasporto, Lionel Chien Hui Tay, Henry Descalzo Bathan | 2014-05-20 |
| 8723338 | Integrated circuit packaging system with array contacts and method of manufacture thereof | Henry Descalzo Bathan, Emmanuel Espiritu | 2014-05-13 |
| 8723324 | Integrated circuit packaging system with pad connection and method of manufacture thereof | Henry Descalzo Bathan, Emmanuel Espiritu, Dioscoro A. Merilo | 2014-05-13 |
| 8722457 | System and apparatus for wafer level integration of components | Dioscoro A. Merilo, Lionel Chien Hui Tay, Henry Descalzo Bathan | 2014-05-13 |
| 8709873 | Leadless integrated circuit packaging system and method of manufacture thereof | — | 2014-04-29 |
| 8698294 | Integrated circuit package system including wide flange leadframe | Jose Alvin Caparas, Arnel Senosa Trasporto, Jeffrey D. Punzalan | 2014-04-15 |
| 8692377 | Integrated circuit packaging system with plated leads and method of manufacture thereof | Henry Descalzo Bathan, Lionel Chien Hui Tay | 2014-04-08 |
| 8669649 | Integrated circuit packaging system with interlock and method of manufacture thereof | Emmanuel Espiritu, Henry Descalzo Bathan | 2014-03-11 |
| 8664038 | Integrated circuit packaging system with stacked paddle and method of manufacture thereof | Arnel Senosa Trasporto, Lionel Chien Hui Tay, Jose Alvin Caparas | 2014-03-04 |
| 8652881 | Integrated circuit package system with anti-peel contact pads | Jairus Legaspi Pisigan, Henry Descalzo Bathan | 2014-02-18 |
| 8643166 | Integrated circuit packaging system with leads and method of manufacturing thereof | Henry Descalzo Bathan, Emmanuel Espiritu | 2014-02-04 |
| 8643157 | Integrated circuit package system having perimeter paddle | Lionel Chien Hui Tay, Jairus Legaspi Pisigan | 2014-02-04 |
| 8633578 | Integrated circuit package system with laminate base | Henry Descalzo Bathan, Arnel Senosa Trasporto, Jeffrey D. Punzalan | 2014-01-21 |
| 8633062 | Integrated circuit package system with integral inner lead and paddle and method of manufacture thereof | Jeffrey D. Punzalan, Henry Descaizo Bathan, Amel Senosa Trasporto | 2014-01-21 |
| 8629537 | Padless die support integrated circuit package system | Henry Descalzo Bathan, Arnel Senosa Trasporto, Jeffrey D. Punzalan | 2014-01-14 |