Issued Patents All Time
Showing 1–25 of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9721925 | Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure | Henry Descalzo Bathan, Zigmund Ramirez Camacho | 2017-08-01 |
| 9472427 | Semiconductor device and method of forming leadframe with notched fingers for stacking semiconductor die | Henry Descalzo Bathan, Zigmund Ramirez Camacho | 2016-10-18 |
| 9034692 | Integrated circuit packaging system with a flip chip and method of manufacture thereof | Henry Descalzo Bathan, Zigmund Ramirez Camacho | 2015-05-19 |
| 8941219 | Etched recess package on package system | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Lionel Chien Hui Tay | 2015-01-27 |
| 8890328 | Semiconductor device and method of forming vertical interconnect structure between non-linear portions of conductive layers | Zigmund Ramirez Camacho, Dioscoro A. Merilo, Frederick R. Dahilig | 2014-11-18 |
| 8872320 | Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure | Henry Descalzo Bathan, Zigmund Ramirez Camacho | 2014-10-28 |
| 8802555 | Integrated circuit packaging system with interconnects and method of manufacture thereof | Henry Descalzo Bathan, Zigmund Ramirez Camacho, Rachel Layda Abinan | 2014-08-12 |
| 8802505 | Semiconductor device and method of forming a protective layer on a backside of the wafer | Henry Descalzo Bathan, Zigmund Ramirez Camacho | 2014-08-12 |
| 8766428 | Integrated circuit packaging system with flip chip and method of manufacture thereof | Zigmund Ramirez Camacho, Henry Descalzo Bathan | 2014-07-01 |
| 8652881 | Integrated circuit package system with anti-peel contact pads | Zigmund Ramirez Camacho, Henry Descalzo Bathan | 2014-02-18 |
| 8643157 | Integrated circuit package system having perimeter paddle | Lionel Chien Hui Tay, Zigmund Ramirez Camacho | 2014-02-04 |
| 8637394 | Integrated circuit package system with flex bump | Henry Descalzo Bathan, Arnel Senosa Trasporto, Jeffrey D. Punzalan | 2014-01-28 |
| 8558369 | Integrated circuit packaging system with interconnects and method of manufacture thereof | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Frederick Rodriguez Gahilig | 2013-10-15 |
| 8513801 | Integrated circuit package system | Lionel Chien Hui Tay, Zigmund Ramirez Camacho | 2013-08-20 |
| 8502371 | Integrated circuit package system with extended corner leads | Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Henry Descalzo Bathan | 2013-08-06 |
| 8354742 | Method and apparatus for a package having multiple stacked die | Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Henry Descalzo Bathan | 2013-01-15 |
| 8338233 | Method of manufacture of integrated circuit packaging system with stacked integrated circuit | Zigmund Ramirez Camacho, Henry Descalzo Bathan | 2012-12-25 |
| 8304337 | Integrated circuit packaging system with bond wire pads and method of manufacture thereof | Henry Descalzo Bathan, Zigmund Ramirez Camacho | 2012-11-06 |
| 8304869 | Fan-in interposer on lead frame for an integrated circuit package on package system | Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Henry Descalzo Bathan | 2012-11-06 |
| 8278148 | Integrated circuit package system with leads separated from a die paddle | Jeffrey D. Punzalan, Lionel Chien Hui Tay, Zigmund Ramirez Camacho | 2012-10-02 |
| 8258614 | Integrated circuit package system with package integration | Zigmund Ramirez Camacho, Abelardo Jr. Hadap Advincula, Lionel Chien Hui Tay | 2012-09-04 |
| 8236607 | Integrated circuit packaging system with stacked integrated circuit and method of manufacture thereof | Henry Descalzo Bathan, Zigmund Ramirez Camacho | 2012-08-07 |
| 8148208 | Integrated circuit package system with leaded package and method for manufacturing thereof | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Lionel Chien Hui Tay | 2012-04-03 |
| 8148825 | Integrated circuit package system with leadfinger | Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Jeffrey D. Punzalan | 2012-04-03 |
| 8129827 | Integrated circuit package system with package encapsulation having recess | Zigmund Ramirez Camacho, Jeffrey D. Punzalan, Abelardo Jr Hadap Advincula | 2012-03-06 |