Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9281300 | Chip scale module package in BGA semiconductor package | Leo A. Merilo, Emmanuel Espiritu, Dario S. Filoteo, Jr. | 2016-03-08 |
| 9000579 | Integrated circuit package system with bonding in via | Il Kwon Shim, Dario S. Filoteo, Jr., Emmanuel Espiritu | 2015-04-07 |
| 8802555 | Integrated circuit packaging system with interconnects and method of manufacture thereof | Henry Descalzo Bathan, Zigmund Ramirez Camacho, Jairus Legaspi Pisigan | 2014-08-12 |
| 8395254 | Integrated circuit package system with heatspreader | Emmanuel Espiritu, Dario S. Filoteo, Jr., Leo A. Merilo, Philip Lyndon Cablao, Allan P. Ilagan | 2013-03-12 |
| 8138080 | Integrated circuit package system having interconnect stack and external interconnect | Dario S. Filoteo, Jr., Leo A. Merilo, Philip Lyndon Cablao, Emmanuel Espiritu, Allan P. Ilagan | 2012-03-20 |
| 8097935 | Quad flat package | Emmanuel Espiritu, Leo A. Merilo, Dario S. Filoteo, Jr. | 2012-01-17 |
| 8097496 | Method of forming quad flat package | Emmanuel Espiritu, Leo A. Merilo, Dario S. Filoteo, Jr. | 2012-01-17 |
| 8026129 | Stacked integrated circuits package system with passive components | Philip Lyndon Cablao, Dario S. Filoteo, Jr., Leo A. Merilo, Emmanuel Espiritu, Allan P. Ilagan | 2011-09-27 |
| 7911046 | Integrated circuit packaging system with interposer | Philip Lyndon Cablao, Dario S. Filoteo, Jr., Allan P. Ilagan | 2011-03-22 |
| 7687892 | Quad flat package | Emmanuel Espiritu, Leo A. Merilo, Dario S. Filoteo, Jr. | 2010-03-30 |
| 7518226 | Integrated circuit packaging system with interposer | Philip Lyndon Cablao, Dario S. Filoteo, Jr., Allan P. Ilagan | 2009-04-14 |