Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8569872 | Integrated circuit package system with lead-frame paddle scheme for single axis partial saw isolation | Henry Descalzo Bathan, Il Kwon Shim, Zigmund Ramirez Camacho, Jose Alvin Caparas | 2013-10-29 |
| 8421221 | Integrated circuit heat spreader stacking system | Dario S. Filoteo, Jr., Emmanuel Espiritu | 2013-04-16 |
| 8395254 | Integrated circuit package system with heatspreader | Emmanuel Espiritu, Dario S. Filoteo, Jr., Leo A. Merilo, Rachel Layda Abinan, Allan P. Ilagan | 2013-03-12 |
| 8344495 | Integrated circuit packaging system with interconnect and method of manufacture thereof | Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Frederick R. Dahilig | 2013-01-01 |
| 8304921 | Integrated circuit packaging system with interconnect and method of manufacture thereof | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Allan P. Ilagan | 2012-11-06 |
| 8138080 | Integrated circuit package system having interconnect stack and external interconnect | Dario S. Filoteo, Jr., Leo A. Merilo, Emmanuel Espiritu, Rachel Layda Abinan, Allan P. Ilagan | 2012-03-20 |
| 8026129 | Stacked integrated circuits package system with passive components | Dario S. Filoteo, Jr., Leo A. Merilo, Emmanuel Espiritu, Rachel Layda Abinan, Allan P. Ilagan | 2011-09-27 |
| 7911046 | Integrated circuit packaging system with interposer | Rachel Layda Abinan, Dario S. Filoteo, Jr., Allan P. Ilagan | 2011-03-22 |
| 7786575 | Stacked die semiconductor device having circuit tape | Dario S. Filoteo, Jr., Emmanuel Espiritu, Leo A. Merilo | 2010-08-31 |
| 7759169 | Integrated circuit heat spreader stacking method | Dario S. Filoteo, Jr., Emmanuel Espiritu | 2010-07-20 |
| 7659608 | Stacked die semiconductor device having circuit tape | Dario S. Filoteo, Jr., Emmanuel Espiritu, Leo A. Merilo | 2010-02-09 |
| 7518226 | Integrated circuit packaging system with interposer | Rachel Layda Abinan, Dario S. Filoteo, Jr., Allan P. Ilagan | 2009-04-14 |
| 7439620 | Integrated circuit package-in-package system | Leo A. Merilo, Emmanuel Espiritu, Dario S. Filoteo, Jr. | 2008-10-21 |