EE

Emmanuel Espiritu

SC Stats Chippac: 52 patents #21 of 425Top 5%
UP Utac Headquarters Pte.: 2 patents #23 of 101Top 25%
Overall (All Time): #46,600 of 4,157,543Top 2%
54
Patents All Time

Issued Patents All Time

Showing 25 most recent of 54 patents

Patent #TitleCo-InventorsDate
12302657 Semiconductor device and method of forming an optical semiconductor package with a shield structure Il Kwon Shim, Jeffrey D. Punzalan, Teddy Joaquin Carreon 2025-05-13
12211863 Reliable semiconductor packages Il Kwon Shim, Jeffrey D. Punzalan, Allan P. Ilagan, Teddy Joaquin Carreon 2025-01-28
9659897 Integrated circuit packaging system with interposer structure and method of manufacture thereof Zigmund Ramirez Camacho, Bartholomew Liao Chung Foh, Dao Nguyen Phu Cuong, Jeffrey D. Punzalan 2017-05-23
9355983 Integrated circuit packaging system with interposer structure and method of manufacture thereof Zigmund Ramirez Camacho, Bartholomew Liao Chung Foh, Dao Nguyen Phu Cuong, Jeffrey D. Punzalan 2016-05-31
9305809 Integrated circuit packaging system with coreless substrate and method of manufacture thereof Allan P. Ilagan, Jeffrey D. Punzalan 2016-04-05
9293351 Integrated circuit packaging system with planarity control and method of manufacture thereof Byung Tai Do, Arnel Senosa Trasporto, Linda Pei Ee Chua 2016-03-22
9281300 Chip scale module package in BGA semiconductor package Leo A. Merilo, Dario S. Filoteo, Jr., Rachel Layda Abinan 2016-03-08
9076737 Integrated circuit packaging system with bumps and method of manufacture thereof Zigmund Ramirez Camacho, Jose Alvin Caparas, Lionel Chien Hui Tay 2015-07-07
9059151 Integrated circuit packaging system with island terminals and embedded paddle and method of manufacture thereof Zigmund Ramirez Camacho, Henry Descalzo Bathan 2015-06-16
9048228 Integrated circuit packaging system with side solderable leads and method of manufacture thereof Byung Tai Do, Allan P. Ilagan, Marites Roque 2015-06-02
9035440 Integrated circuit packaging system with a lead and method of manufacture thereof Elizar Andres, Henry Descalzo Bathan, Zigmund Ramirez Camacho 2015-05-19
9006031 Semiconductor device and method of forming EWLB package with standoff conductive layer over encapsulant bumps Zigmund Ramirez Camacho, Henry Descalzo Bathan 2015-04-14
9000579 Integrated circuit package system with bonding in via Il Kwon Shim, Dario S. Filoteo, Jr., Rachel Layda Abinan 2015-04-07
8993376 Semiconductor device and method of forming wafer-level multi-row etched leadframe with base leads and embedded semiconductor die Zigmund Ramirez Camacho, Henry Descalzo Bathan, Dioscoro A. Merilo 2015-03-31
8936971 Integrated circuit packaging system with die paddles and method of manufacture thereof Zigmund Ramirez Camacho, Henry Descalzo Bathan 2015-01-20
8912046 Integrated circuit packaging system with lead frame and method of manufacture thereof Henry Descalzo Bathan, Zigmund Ramirez Camacho 2014-12-16
8866275 Leadframe interposer over semiconductor die and TSV substrate for vertical electrical interconnect Zigmund Ramirez Camacho, Dioscoro A. Merilo, Henry Descalzo Bathan 2014-10-21
8809119 Integrated circuit packaging system with plated leads and method of manufacture thereof Henry Descalzo Bathan, Byung Tai Do 2014-08-19
8803300 Integrated circuit packaging system with protective coating and method of manufacture thereof Henry Descalzo Bathan, Zigmund Ramirez Camacho, Jeffrey D. Punzalan 2014-08-12
8802501 Integrated circuit packaging system with island terminals and method of manufacture thereof Zigmund Ramirez Camacho, Henry Descalzo Bathan, Byung Tai Do, Arnel Senosa Trasporto, Linda Pei Ee Chua 2014-08-12
8723338 Integrated circuit packaging system with array contacts and method of manufacture thereof Henry Descalzo Bathan, Zigmund Ramirez Camacho 2014-05-13
8723324 Integrated circuit packaging system with pad connection and method of manufacture thereof Zigmund Ramirez Camacho, Henry Descalzo Bathan, Dioscoro A. Merilo 2014-05-13
8669649 Integrated circuit packaging system with interlock and method of manufacture thereof Zigmund Ramirez Camacho, Henry Descalzo Bathan 2014-03-11
8643166 Integrated circuit packaging system with leads and method of manufacturing thereof Zigmund Ramirez Camacho, Henry Descalzo Bathan 2014-02-04
8617933 Integrated circuit packaging system with interlock and method of manufacture thereof Zigmund Ramirez Camacho, Henry Descalzo Bathan, Dioscoro A. Merilo 2013-12-31