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Emmanuel Espiritu — 54 Patents

SCStats Chippac: 52 patents #23 of 425Top 6%
UPUtac Headquarters Pte.: 2 patents #23 of 101Top 25%
Singapore, SG: #59 of 13,971 inventorsTop 1%
Overall (All Time): #46,969 of 4,157,543Top 2%
54 Patents All Time
Emmanuel Espiritu has been granted 54 US patents while listed as an inventor at Stats Chippac. The first was granted in 2008 and the most recent in May 2025. Emmanuel Espiritu ranks #46,969 of 4,157,543 US inventors in our database (top 1.1%). Patent records list Emmanuel Espiritu in Singapore, SG.

Patents per Year

Patents granted per year, 2008 to 2025Bar chart with a peak of 13 patents in 2013.peak 132008: 1 patents20082010: 4 patents20102011: 3 patents20112012: 9 patents20122013: 13 patents20132014: 9 patents20142015: 8 patents20152016: 4 patents20162017: 1 patents20172025: 2 patents2025

Issued Patents All Time

Showing 1–25 of 54 patents

Patent #TitleCo-InventorsDate
12302657 Semiconductor device and method of forming an optical semiconductor package with a shield structure Il Kwon Shim, Jeffrey D. Punzalan, Teddy Joaquin Carreon 2025-05-13
12211863 Reliable semiconductor packages Il Kwon Shim, Jeffrey D. Punzalan, Allan P. Ilagan, Teddy Joaquin Carreon 2025-01-28
9659897 Integrated circuit packaging system with interposer structure and method of manufacture thereof Zigmund Ramirez Camacho, Bartholomew Liao Chung Foh, Dao Nguyen Phu Cuong, Jeffrey D. Punzalan 2017-05-23
9355983 Integrated circuit packaging system with interposer structure and method of manufacture thereof Zigmund Ramirez Camacho, Bartholomew Liao Chung Foh, Dao Nguyen Phu Cuong, Jeffrey D. Punzalan 2016-05-31
9305809 Integrated circuit packaging system with coreless substrate and method of manufacture thereof Allan P. Ilagan, Jeffrey D. Punzalan 2016-04-05
9293351 Integrated circuit packaging system with planarity control and method of manufacture thereof Byung Tai Do, Arnel Senosa Trasporto, Linda Pei Ee Chua 2016-03-22
9281300 Chip scale module package in BGA semiconductor package Leo A. Merilo, Dario S. Filoteo, Jr., Rachel Layda Abinan 2016-03-08
9076737 Integrated circuit packaging system with bumps and method of manufacture thereof Zigmund Ramirez Camacho, Jose Alvin Caparas, Lionel Chien Hui Tay 2015-07-07
9059151 Integrated circuit packaging system with island terminals and embedded paddle and method of manufacture thereof Zigmund Ramirez Camacho, Henry Descalzo Bathan 2015-06-16
9048228 Integrated circuit packaging system with side solderable leads and method of manufacture thereof Byung Tai Do, Allan P. Ilagan, Marites Roque 2015-06-02
9035440 Integrated circuit packaging system with a lead and method of manufacture thereof Elizar Andres, Henry Descalzo Bathan, Zigmund Ramirez Camacho 2015-05-19
9006031 Semiconductor device and method of forming EWLB package with standoff conductive layer over encapsulant bumps Zigmund Ramirez Camacho, Henry Descalzo Bathan 2015-04-14
9000579 Integrated circuit package system with bonding in via Il Kwon Shim, Dario S. Filoteo, Jr., Rachel Layda Abinan 2015-04-07
8993376 Semiconductor device and method of forming wafer-level multi-row etched leadframe with base leads and embedded semiconductor die Zigmund Ramirez Camacho, Henry Descalzo Bathan, Dioscoro A. Merilo 2015-03-31
8936971 Integrated circuit packaging system with die paddles and method of manufacture thereof Zigmund Ramirez Camacho, Henry Descalzo Bathan 2015-01-20
8912046 Integrated circuit packaging system with lead frame and method of manufacture thereof Henry Descalzo Bathan, Zigmund Ramirez Camacho 2014-12-16
8866275 Leadframe interposer over semiconductor die and TSV substrate for vertical electrical interconnect Zigmund Ramirez Camacho, Dioscoro A. Merilo, Henry Descalzo Bathan 2014-10-21
8809119 Integrated circuit packaging system with plated leads and method of manufacture thereof Henry Descalzo Bathan, Byung Tai Do 2014-08-19
8803300 Integrated circuit packaging system with protective coating and method of manufacture thereof Henry Descalzo Bathan, Zigmund Ramirez Camacho, Jeffrey D. Punzalan 2014-08-12
8802501 Integrated circuit packaging system with island terminals and method of manufacture thereof Zigmund Ramirez Camacho, Henry Descalzo Bathan, Byung Tai Do, Arnel Senosa Trasporto, Linda Pei Ee Chua 2014-08-12
8723338 Integrated circuit packaging system with array contacts and method of manufacture thereof Henry Descalzo Bathan, Zigmund Ramirez Camacho 2014-05-13
8723324 Integrated circuit packaging system with pad connection and method of manufacture thereof Zigmund Ramirez Camacho, Henry Descalzo Bathan, Dioscoro A. Merilo 2014-05-13
8669649 Integrated circuit packaging system with interlock and method of manufacture thereof Zigmund Ramirez Camacho, Henry Descalzo Bathan 2014-03-11
8643166 Integrated circuit packaging system with leads and method of manufacturing thereof Zigmund Ramirez Camacho, Henry Descalzo Bathan 2014-02-04
8617933 Integrated circuit packaging system with interlock and method of manufacture thereof Zigmund Ramirez Camacho, Henry Descalzo Bathan, Dioscoro A. Merilo 2013-12-31

Frequent Collaborators

Zigmund Ramirez Camacho34 shared
Henry Descalzo Bathan32 shared
Dario S. Filoteo, Jr.14 shared
Leo A. Merilo10 shared
Dioscoro A. Merilo8 shared
Philip Lyndon Cablao8 shared

Nearby-Ranked Inventors

Youyang Yu54
Jarrett Simerson54
Avidan Akerib54
Kuan-Neng Chen54
Pratap Dande54
Benjamin Schwarz54
Hyun Duk Cho54
Michael Joseph Murphy54
Jason C. Sauers54