Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Integrated circuit package system with bonding in via

Integrated circuit package system with bonding in via

US Patent 9000579 · Granted Apr 7, 2015

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device and method of forming embedded wafer level chip scale packa2025
Semiconductor device and method of forming an optical semiconductor package with2025
Semiconductor device and method of forming an optical semiconductor package with2025
Reliable semiconductor packages2025
Reliable semiconductor packages2025
Reliable semiconductor packages2024
Reliable semiconductor packages2024
Semiconductor device and method of making a wafer-level chip-scale package2024
Semiconductor packages with integrated shielding2024
Semiconductor package with dams2024
Semiconductor device and method of forming a 3D interposer system-in-package mod2023
EMI shielding for flip chip package with exposed die backside2023