Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9281300 | Chip scale module package in BGA semiconductor package | Leo A. Merilo, Emmanuel Espiritu, Rachel Layda Abinan | 2016-03-08 |
| 9034693 | Integrated circuit package with open substrate and method of manufacturing thereof | Il Kwon Shim, Kwee Lan Tan, Jian Li | 2015-05-19 |
| 9000579 | Integrated circuit package system with bonding in via | Il Kwon Shim, Emmanuel Espiritu, Rachel Layda Abinan | 2015-04-07 |
| 8421221 | Integrated circuit heat spreader stacking system | Emmanuel Espiritu, Philip Lyndon Cablao | 2013-04-16 |
| 8395254 | Integrated circuit package system with heatspreader | Emmanuel Espiritu, Leo A. Merilo, Philip Lyndon Cablao, Rachel Layda Abinan, Allan P. Ilagan | 2013-03-12 |
| 8138080 | Integrated circuit package system having interconnect stack and external interconnect | Leo A. Merilo, Philip Lyndon Cablao, Emmanuel Espiritu, Rachel Layda Abinan, Allan P. Ilagan | 2012-03-20 |
| 8097935 | Quad flat package | Emmanuel Espiritu, Leo A. Merilo, Rachel Layda Abinan | 2012-01-17 |
| 8097496 | Method of forming quad flat package | Emmanuel Espiritu, Leo A. Merilo, Rachel Layda Abinan | 2012-01-17 |
| 8030783 | Integrated circuit package with open substrate | Il Kwon Shim, Kwee Lan Tan, Jian Li | 2011-10-04 |
| 8026129 | Stacked integrated circuits package system with passive components | Philip Lyndon Cablao, Leo A. Merilo, Emmanuel Espiritu, Rachel Layda Abinan, Allan P. Ilagan | 2011-09-27 |
| 8021931 | Direct via wire bonding and method of assembling the same | Emmanuel Espiritu | 2011-09-20 |
| 7928564 | Multichip module package and fabrication method | Il Kwon Shim, Tsz Yin Ho, Sebastian T. M. Soon | 2011-04-19 |
| 7911046 | Integrated circuit packaging system with interposer | Philip Lyndon Cablao, Rachel Layda Abinan, Allan P. Ilagan | 2011-03-22 |
| 7863730 | Array-molded package heat spreader and fabrication method therefor | Il Kwon Shim, Kambhampati Ramakrishna, Diane Sahakian, Seng Guan Chow, Virgil Ararao | 2011-01-04 |
| 7786575 | Stacked die semiconductor device having circuit tape | Philip Lyndon Cablao, Emmanuel Espiritu, Leo A. Merilo | 2010-08-31 |
| 7759169 | Integrated circuit heat spreader stacking method | Emmanuel Espiritu, Philip Lyndon Cablao | 2010-07-20 |
| 7687892 | Quad flat package | Emmanuel Espiritu, Leo A. Merilo, Rachel Layda Abinan | 2010-03-30 |
| 7659608 | Stacked die semiconductor device having circuit tape | Philip Lyndon Cablao, Emmanuel Espiritu, Leo A. Merilo | 2010-02-09 |
| 7626277 | Integrated circuit package with open substrate | Il Kwon Shim, Kwee Lan Tan, Jian Li | 2009-12-01 |
| 7622325 | Integrated circuit package system including high-density small footprint system-in-package | Il Kwon Shim, Tsz Yin Ho, Seng Guan Chow | 2009-11-24 |
| 7619314 | Integrated circuit package system including die stacking | Tsz Yin Ho | 2009-11-17 |
| 7518226 | Integrated circuit packaging system with interposer | Philip Lyndon Cablao, Rachel Layda Abinan, Allan P. Ilagan | 2009-04-14 |
| 7445955 | Multichip module package and fabrication method | Il Kwon Shim, Tsz Yin Ho, Sebastian T. M. Soon | 2008-11-04 |
| 7439620 | Integrated circuit package-in-package system | Leo A. Merilo, Emmanuel Espiritu, Philip Lyndon Cablao | 2008-10-21 |
| 7298038 | Integrated circuit package system including die stacking | Tsz Yin Ho | 2007-11-20 |