Issued Patents All Time
Showing 26–29 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7008820 | Chip scale package with open substrate | Il Kwon Shim, Kwee Lan Tan, Jian Li | 2006-03-07 |
| 6943057 | Multichip module package and fabrication method | Il Kwon Shim, Tsz Yin Ho, Sebastian T. M. Soon | 2005-09-13 |
| 6875634 | Heat spreader anchoring and grounding method and thermally enhanced PBGA package using the same | Il Kwon Shim, Hermes T. Apale, Weddie Aquien, Virgil Ararao, Leo A. Merilo | 2005-04-05 |
| 6737298 | Heat spreader anchoring & grounding method & thermally enhanced PBGA package using the same | Il Kwon Shim, Hermes T. Apale, Weddle Aquien, Virgil Ararao, Leo A. Merilo | 2004-05-18 |