Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8513542 | Integrated circuit leaded stacked package system | Heap Hoe Kuan, Dioscoro A. Merilo, Seng Guan Chow, Antonio B. Dimaano, Jr. | 2013-08-20 |
| 8164172 | Integrated circuit package in package system | Dioscoro A. Merilo, Seng Guan Chow, Antonio B. Dimaanor, Jr., Heap Hoe Kuan | 2012-04-24 |
| 7986043 | Integrated circuit package on package system | Dioscoro A. Merilo, Seng Guan Chow, Antonio B. Dimaano, Jr., Heap Hoe Kuan | 2011-07-26 |
| 7981702 | Integrated circuit package in package system | Dioscoro A. Merilo, Seng Guan Chow, Antonio B. Dimaano, Jr., Heap Hoe Kuan | 2011-07-19 |
| 7928564 | Multichip module package and fabrication method | Il Kwon Shim, Dario S. Filoteo, Jr., Sebastian T. M. Soon | 2011-04-19 |
| 7622325 | Integrated circuit package system including high-density small footprint system-in-package | Il Kwon Shim, Dario S. Filoteo, Jr., Seng Guan Chow | 2009-11-24 |
| 7619314 | Integrated circuit package system including die stacking | Dario S. Filoteo, Jr. | 2009-11-17 |
| 7445955 | Multichip module package and fabrication method | Il Kwon Shim, Dario S. Filoteo, Jr., Sebastian T. M. Soon | 2008-11-04 |
| 7298038 | Integrated circuit package system including die stacking | Dario S. Filoteo, Jr. | 2007-11-20 |
| 6943057 | Multichip module package and fabrication method | Il Kwon Shim, Dario S. Filoteo, Jr., Sebastian T. M. Soon | 2005-09-13 |