SS

Sebastian T. M. Soon

SC Stats Chippac: 3 patents #180 of 425Top 45%
📍 Singapore, SG: #2,988 of 13,971 inventorsTop 25%
Overall (All Time): #1,560,453 of 4,157,543Top 40%
3
Patents All Time

Issued Patents All Time

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
7928564 Multichip module package and fabrication method Il Kwon Shim, Dario S. Filoteo, Jr., Tsz Yin Ho 2011-04-19
7445955 Multichip module package and fabrication method Il Kwon Shim, Dario S. Filoteo, Jr., Tsz Yin Ho 2008-11-04
6943057 Multichip module package and fabrication method Il Kwon Shim, Dario S. Filoteo, Jr., Tsz Yin Ho 2005-09-13