Issued Patents All Time
Showing 25 most recent of 143 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10217873 | Semiconductor device and method of forming semiconductor die with active region responsive to external stimulus | Byung Joon Han, Il Kwon Shim | 2019-02-26 |
| 9847253 | Package-on-package using through-hole via die on saw streets | Byung Tai Do, Seng Guan Chow | 2017-12-19 |
| 9564413 | Semiconductor device and method of forming semiconductor die with active region responsive to external stimulus | Byung Joon Han, Il Kwon Shim | 2017-02-07 |
| 9553162 | Semiconductor device and method of forming semiconductor die with active region responsive to external stimulus | Thomas Strothmann, Steve Anderson, Byung Joon Han, Il Kwon Shim | 2017-01-24 |
| 9524955 | Semiconductor device and method of forming no-flow underfill material around vertical interconnect structure | Rui Huang, Yaojian Lin, Seng Guan Chow | 2016-12-20 |
| 9524938 | Package-in-package using through-hole via die on saw streets | Byung Tai Do, Seng Guan Chow | 2016-12-20 |
| 9515016 | Semiconductor package and method of forming z-direction conductive posts embedded in structurally protective encapsulant | Rui Huang, Il Kwon Shim, Seng Guan Chow | 2016-12-06 |
| 9406647 | Extended redistribution layers bumped wafer | Byung Tai Do | 2016-08-02 |
| 9299648 | Integrated circuit packaging system with patterned substrate and method of manufacture thereof | Il Kwon Shim, Seng Guan Chow | 2016-03-29 |
| 9293350 | Semiconductor package system with cavity substrate and manufacturing method therefor | Seng Guan Chow, Rui Huang | 2016-03-22 |
| 9275877 | Semiconductor device and method of forming semiconductor package using panel form carrier | Yaojian Lin, Rui Huang, Seng Guan Chow | 2016-03-01 |
| 9257356 | Semiconductor device and method of forming an IPD beneath a semiconductor die with direct connection to external devices | Rui Huang, Yaojian Lin, Seng Guan Chow | 2016-02-09 |
| 9177848 | Semiconductor wafer having through-hole vias on saw streets with backside redistribution layer | Byung Tai Do, Linda Pei Ee Chua | 2015-11-03 |
| 9123733 | Integrated circuit packaging system with package underfill and method of manufacture thereof | Rui Huang, Yaojian Lin, Seng Guan Chow | 2015-09-01 |
| 9099455 | Semiconductor device and method of forming conductive posts embedded in photosensitive encapsulant | Seng Guan Chow, Il Kwon Shim, Rui Huang | 2015-08-04 |
| 9064876 | Semiconductor device and method of mounting die with TSV in cavity of substrate for electrical interconnect of Fi-PoP | Reza A. Pagaila, Dioscoro A. Merilo | 2015-06-23 |
| 9059186 | Embedded semiconductor die package and method of making the same using metal frame carrier | Il Kwon Shim, Seng Guan Chow | 2015-06-16 |
| 9048197 | Integrated circuit package system employing wafer level chip scale packaging | Byung Tai Do | 2015-06-02 |
| 9030006 | Integrated circuit package system with internal stacking module | Seng Guan Chow, Reza A. Pagaila | 2015-05-12 |
| 9029205 | Integrated circuit packaging system having planar interconnect and method for manufacture thereof | Reza A. Pagaila, Byung Tai Do | 2015-05-12 |
| 9006882 | Semiconductor device and method of forming recessed conductive vias in saw streets | Reza A. Pagaila, Byung Tai Do | 2015-04-14 |
| 8963309 | Semiconductor package with penetrable encapsulant joining semiconductor die and method thereof | Byung Tai Do, Seng Guan Chow, Linda Pei Ee Chua, Rui Huang | 2015-02-24 |
| 8957530 | Integrated circuit packaging system with embedded circuitry and post | Il Kwon Shim, Seng Guan Chow, Seung Uk Yoon, Jong-Woo Ha | 2015-02-17 |
| 8878361 | Leadless package system having external contacts | Byung Tai Do, Linda Pei Ee Chua | 2014-11-04 |
| 8852986 | Integrated circuit package system employing resilient member mold system technology | Pei Ee Chua, Seng Guan Chow | 2014-10-07 |