Issued Patents All Time
Showing 25 most recent of 56 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12426407 | Method of manufacturing a fluorescent substance | Sung Yoon Lee, Soon Min KIM | 2025-09-23 |
| 11679527 | Manufacturing method of ceramic chips | Sung Yoon Lee, Soon Min KIM | 2023-06-20 |
| 9768485 | Duplexer | Hak Rae Cho, Soo Duk Seo, Moon Bong Ko | 2017-09-19 |
| 9355962 | Integrated circuit package stacking system with redistribution and method of manufacture thereof | Seongmin Lee, Sungmin Song | 2016-05-31 |
| 9330945 | Integrated circuit package system with multi-chip module | Sungmin Song, SeungYun Ahn, JoHyun Bae | 2016-05-03 |
| 9323845 | Portable communication terminal for extracting subjects of interest to the user, and a method therefor | Sang Keun Lee, Jung-hyun Lee | 2016-04-26 |
| 9236319 | Stacked integrated circuit package system | Flynn Carson, BumJoon Hong, Seongmin Lee | 2016-01-12 |
| 9230898 | Integrated circuit packaging system with package-on-package and method of manufacture thereof | HanGil Shin, DeokKyung Yang | 2016-01-05 |
| 8987056 | Integrated circuit package system with support carrier and method of manufacture thereof | Sung Yoon Lee, Taeg Ki Lim | 2015-03-24 |
| 8957530 | Integrated circuit packaging system with embedded circuitry and post | Il Kwon Shim, Seng Guan Chow, Heap Hoe Kuan, Seung Uk Yoon | 2015-02-17 |
| 8823160 | Integrated circuit package system having cavity | DaeSik Choi, DeokKyung Yang | 2014-09-02 |
| 8810018 | Stacked integrated circuit package system with face to face stack configuration | Sang Ho Lee, Soo-San Park | 2014-08-19 |
| 8692388 | Integrated circuit package system with waferscale spacer | Sang Ho Lee, Soo-San Park | 2014-04-08 |
| 8642383 | Dual-die package structure having dies externally and simultaneously connected via bump electrodes and bond wires | BumJoon Hong | 2014-02-04 |
| 8633058 | Integrated circuit packaging system with step mold and method of manufacture thereof | DaeSik Choi, Seung-Won Kim | 2014-01-21 |
| 8617924 | Stacked integrated circuit package-in-package system and method of manufacture thereof | OhSug Kim, Jong Wook Ju | 2013-12-31 |
| 8581380 | Integrated circuit packaging system with ultra-thin die | Soo-San Park, Sang Ho Lee | 2013-11-12 |
| 8531043 | Planar encapsulation and mold cavity package in package system | Reza A. Pagaila | 2013-09-10 |
| 8481420 | Integrated circuit packaging system with lead frame stacking module and method of manufacture thereof | DaeSik Choi, Byoung Wook Jang | 2013-07-09 |
| 8405197 | Integrated circuit packaging system with stacked configuration and method of manufacture thereof | DaeSik Choi, Byoung Wook Jang | 2013-03-26 |
| 8383458 | Integrated circuit package system employing an offset stacked configuration and method for manufacturing thereof | DaeSik Choi, BumJoon Hong, Sang Ho Lee, Soo-San Park | 2013-02-26 |
| 8241955 | Integrated circuit packaging system with mountable inward and outward interconnects and method of manufacture thereof | Reza A. Pagaila, Byung Tai Do | 2012-08-14 |
| 8211749 | Integrated circuit package system with waferscale spacer | Sang Ho Lee, Soo-San Park | 2012-07-03 |
| 8211746 | Integrated circuit packaging system with lead frame and method of manufacture thereof | TaeWoo Kang, DongSoo Moon | 2012-07-03 |
| 8143104 | Method for manufacturing ball grid array package stacking system | — | 2012-03-27 |