Issued Patents All Time
Showing 25 most recent of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8906740 | Integrated circuit packaging system having dual sided connection and method of manufacture thereof | Chan Hoon Ko, YoungChul Kim | 2014-12-09 |
| 8810018 | Stacked integrated circuit package system with face to face stack configuration | Jong-Woo Ha, Sang Ho Lee | 2014-08-19 |
| 8692365 | Integrated circuit packaging system with thermal dispersal structures and method of manufacture thereof | DongSoo Moon, Taewoo Lee, SooMoon Park, Sang Ho Lee | 2014-04-08 |
| 8692388 | Integrated circuit package system with waferscale spacer | Sang Ho Lee, Jong-Woo Ha | 2014-04-08 |
| 8685797 | Integrated circuit packaging system with encapsulation and underfill and method of manufacture thereof | Sang Ho Lee, DaeSik Choi | 2014-04-01 |
| 8581380 | Integrated circuit packaging system with ultra-thin die | Sang Ho Lee, Jong-Woo Ha | 2013-11-12 |
| 8559185 | Integrated circuit package system with stackable devices and a method of manufacture thereof | Sang Ho Lee, DaeSik Choi | 2013-10-15 |
| 8390110 | Integrated circuit packaging system with cavity and method of manufacture thereof | Sang Ho Lee, Taewoo Lee | 2013-03-05 |
| 8383458 | Integrated circuit package system employing an offset stacked configuration and method for manufacturing thereof | DaeSik Choi, BumJoon Hong, Sang Ho Lee, Jong-Woo Ha | 2013-02-26 |
| 8273607 | Integrated circuit packaging system with encapsulation and underfill and method of manufacture thereof | Sang Ho Lee, DaeSik Choi | 2012-09-25 |
| 8247893 | Mountable integrated circuit package system with intra-stack encapsulation | Youngjoon KIM | 2012-08-21 |
| 8211749 | Integrated circuit package system with waferscale spacer | Sang Ho Lee, Jong-Woo Ha | 2012-07-03 |
| 8189344 | Integrated circuit package system for stackable devices | Sang Ho Lee, DaeSik Choi | 2012-05-29 |
| 8115293 | Integrated circuit packaging system with interconnect and method of manufacture thereof | DongSoo Moon, Taewoo Lee, SooMoon Park, Sang Ho Lee | 2012-02-14 |
| 8102666 | Integrated circuit package system | HyungSang Park, In Sang Yoon, DeokKyung Yang | 2012-01-24 |
| 8093727 | Integrated circuit package-in-package system with side-by-side and offset stacking and method for manufacturing thereof | BumJoon Hong, Sang Ho Lee, Jong-Woo Ha | 2012-01-10 |
| 8067307 | Integrated circuit package system for stackable devices | DaeSik Choi, Sang Ho Lee | 2011-11-29 |
| 8067828 | System for solder ball inner stacking module connection | Chan Hoon Ko | 2011-11-29 |
| 8039365 | Integrated circuit package system including wafer level spacer | Sang Ho Lee, Jong-Woo Ha | 2011-10-18 |
| 8004073 | Integrated circuit packaging system with interposer and method of manufacture thereof | Chan Hoon Ko | 2011-08-23 |
| 7968995 | Integrated circuit packaging system with package-on-package and method of manufacture thereof | Chan Hoon Ko, HeeJo Chi | 2011-06-28 |
| 7923290 | Integrated circuit packaging system having dual sided connection and method of manufacture thereof | Chan Hoon Ko, YoungChul Kim | 2011-04-12 |
| 7872340 | Integrated circuit package system employing an offset stacked configuration | DaeSik Choi, BumJoon Hong, Sang Ho Lee, Jong-Woo Ha | 2011-01-18 |
| 7863761 | Integrated circuit package system with molding vents | Dal Jae Lee, Nam Ju Cho, Jaepil Kim, Sungpil Hur, Hyeong Kug Jin +3 more | 2011-01-04 |
| 7829986 | Integrated circuit package system with net spacer | Sang Ho Lee, Jong-Woo Ha | 2010-11-09 |