Issued Patents All Time
Showing 25 most recent of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11793772 | Pharmaceutical composition comprising THA as active ingredient for treating breast cancer | Keon Wook Kang, Kwang Seok Oh, Sung Baek Jeong | 2023-10-24 |
| 11506558 | Apparatus and method for inspecting ventilation | Seunghyun Hwang, Dongeon KIM | 2022-11-22 |
| 11201144 | Electrostatic discharge handling for sense IGBT using Zener diode | Hye Mi Kim, Kyu-Hyun Lee, Seunghyun Hong | 2021-12-14 |
| 10604003 | Hydraulic pressure supply system of automatic transmission for hybrid vehicle and cooling the jacket of a motor with low pressure supply to low pressure part | Jong Hyun Kim, Hee Ra Lee | 2020-03-31 |
| 10410834 | Reverse power reducing method and plasma power apparatus using the same | Seunghee Ryu, Minjae KIM | 2019-09-10 |
| 10276351 | High-frequency power generator with enhanced pulse function | Jongwoon Kim, Eunmin Jeon, Minjae KIM | 2019-04-30 |
| 10035152 | Solenoid valve | June Ho Lee | 2018-07-31 |
| 9721921 | Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form | KyungMoon Kim, KooHong Lee, JaeHak Yee, Lan H. Hoang, Pandi C. Marimuthu +3 more | 2017-08-01 |
| 9631614 | Oil supply system | Jong Hyun Kim, Taeho Kim, Seungjae Kang | 2017-04-25 |
| 9559046 | Semiconductor device and method of forming a fan-in package-on-package structure using through silicon vias | Hyunil Bae, Myungkil Lee | 2017-01-31 |
| 9524958 | Semiconductor device and method of individual die bonding followed by simultaneous multiple die thermal compression bonding | JoonYoung Choi, YongHee Kang, HunTeak Lee, KeonTaek Kang | 2016-12-20 |
| 9385100 | Integrated circuit packaging system with surface treatment and method of manufacture thereof | Hun Teak Lee, Hyunll Bae, HeeSoo Lee, HeeJo Chi | 2016-07-05 |
| 9287204 | Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form | KyungMoon Kim, KooHong Lee, JaeHak Yee, Lan H. Hoang, Pandi C. Marimuthu +3 more | 2016-03-15 |
| 9252130 | Methods of manufacturing flip chip semiconductor packages using double-sided thermal compression bonding | KyungMoon Kim, HunTeak Lee, KeonTaek Kang, HeeJo Chi | 2016-02-02 |
| 9245770 | Semiconductor device and method of simultaneous molding and thermalcompression bonding | KyungMoon Kim, KooHong Lee, JaeHak Yee, Lan H. Hoang, Pandi C. Marimuthu +2 more | 2016-01-26 |
| 9245772 | Stackable package by using internal stacking modules | JoungIn Yang, Choongbin Yim, KeonTeak Kang | 2016-01-26 |
| 9240331 | Semiconductor device and method of making bumpless flipchip interconnect structures | KyungMoon Kim, KooHong Lee, JaeHak Yee, Lan H. Hoang, Pandi C. Marimuthu +3 more | 2016-01-19 |
| 9202715 | Integrated circuit packaging system with connection structure and method of manufacture thereof | KyungHoon Lee, Seong Won Park, Ki Youn Jang, Jaehyun Lee, DeokKyung Yang +2 more | 2015-12-01 |
| 9093415 | Integrated circuit packaging system with heat spreader and method of manufacture thereof | Oh Han Kim, Sell Jung, HeeSoo Lee, Jae Han Chung | 2015-07-28 |
| 8906740 | Integrated circuit packaging system having dual sided connection and method of manufacture thereof | Chan Hoon Ko, Soo-San Park | 2014-12-09 |
| 8900096 | Method for diagnosing and controlling an unusual hydraulic state of hybrid vehicle transmission | Sanghyun Jeong, Jong Hyun Kim, Jang Mi Lee, SanLok Song, Seungjae Kang +3 more | 2014-12-02 |
| 8816487 | Integrated circuit packaging system with package-in-package and method of manufacture thereof | Hyunil Bae, Myung Kil Lee | 2014-08-26 |
| 8790207 | Hydraulic control system of automatic transmission for hybrid vehicle | Gwang Seob Shin, Jong Hyun Kim, Jang Mi Lee, Yeonho Kim, Jaeshin Yi | 2014-07-29 |
| 8774996 | Cooling system for cooling driving motor of hybrid vehicle and method for controlling the same | Gwang Seob Shin, Jong Hyun Kim, Jang Mi Lee, Jaeshin Yi | 2014-07-08 |
| 8501540 | Method for manufacture of inline integrated circuit system | Jae Hak Yee, Junwoo Myung, Byoung Wook Jang | 2013-08-06 |