Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12331983 | Refrigerator | — | 2025-06-17 |
| 11888038 | Integrated circuit devices and methods of manufacturing the same | — | 2024-01-30 |
| 11171038 | Fabrication method of integrated circuit semiconductor device | Namho Jeon, Jiyoung Kim, Junsoo Kim, Dongsoo Woo | 2021-11-09 |
| 9780063 | Semiconductor device and method of forming bump structure with insulating buffer layer to reduce stress on semiconductor wafer | Youngjoon KIM, SungWon Cho | 2017-10-03 |
| 9524958 | Semiconductor device and method of individual die bonding followed by simultaneous multiple die thermal compression bonding | YongHee Kang, HunTeak Lee, KeonTaek Kang, YoungChul Kim | 2016-12-20 |
| 9252093 | Semiconductor device and method of forming multi-layered UBM with intermediate insulating buffer layer to reduce stress for semiconductor wafer | DaeSik Choi, Wonll Kwon | 2016-02-02 |
| 9093278 | Method of manufacture of integrated circuit packaging system with plasma processing | Seong Won Park, KyungOe Kim, Hun Teak Lee, SungWon Cho | 2015-07-28 |
| 9059108 | Integrated circuit packaging system with interconnects | DaeSik Choi, YongHyuk Jeong | 2015-06-16 |
| 8994048 | Semiconductor device and method of forming recesses in substrate for same size or different sized die with vertical integration | YongHee Kang | 2015-03-31 |
| 8835301 | Semiconductor device and method of forming bump structure with insulating buffer layer to reduce stress on semiconductor wafer | Youngjoon KIM, SungWon Cho | 2014-09-16 |
| 8642469 | Semiconductor device and method of forming multi-layered UBM with intermediate insulating buffer layer to reduce stress for semiconductor wafer | DaeSik Choi, Wonll Kwon | 2014-02-04 |
| 8546194 | Integrated circuit packaging system with interconnects and method of manufacture thereof | YongHyuk Jeong, DaeSik Choi | 2013-10-01 |
| 8343853 | Semiconductor wafer, semiconductor device using the same, and method and apparatus for producing the same | Tae-Hyoung Koo, Sam-jong Choi, Yeonsook Kim, Taesung Kim, Heesung Kim +1 more | 2013-01-01 |
| 8288203 | Semiconductor device and method of forming a wafer level package structure using conductive via and exposed bump | SungWon Cho, DaeSik Choi | 2012-10-16 |
| 7321602 | Apparatus and method for inserting null packet in digital broadcasting transmission system | Byungjun Bae, Jinhwan Lee, Youngkwon Hahm, Chieteuk Ahn | 2008-01-22 |