Issued Patents All Time
Showing 25 most recent of 81 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10665534 | Semiconductor device and method of using partial wafer singulation for improved wafer level embedded system in package | KyungHoon Lee, SangMi Park, KyoungIl Huh | 2020-05-26 |
| 10163744 | Semiconductor device and method of forming a low profile dual-purpose shield and heat-dissipation structure | OhHan Kim, WonJun Ko | 2018-12-25 |
| 10068877 | Semiconductor device and method of forming WLCSP with semiconductor die embedded within interconnect structure | KyungHoon Lee, HyunJin Song, Kyoungll Huh | 2018-09-04 |
| 9799590 | Semiconductor device and method of using partial wafer singulation for improved wafer level embedded system in package | KyungHoon Lee, SangMi Park, KyoungIl Huh | 2017-10-24 |
| 9530753 | Integrated circuit packaging system with chip stacking and method of manufacture thereof | Daesup Kim, Youngjoon KIM | 2016-12-27 |
| 9406579 | Semiconductor device and method of controlling warpage in semiconductor package | JoungIn Yang, Sang Mi Park, WonIl Kwon, YiSu Park | 2016-08-02 |
| 9401289 | Semiconductor device and method of backgrinding and singulation of semiconductor wafer while reducing kerf shifting and protecting wafer surfaces | Minjung Kim, KyungHoon Lee, JoungIn Yang, WonIl Kwon | 2016-07-26 |
| 9390945 | Semiconductor device and method of depositing underfill material with uniform flow rate | KyungHoon Lee, JoungIn Yang, Sang Mi Park, YiSu Park | 2016-07-12 |
| 9378983 | Semiconductor device and method of mounting cover to semiconductor die and interposer with adhesive material | Sang Mi Park, KyungHoon Lee | 2016-06-28 |
| 9373578 | Semiconductor device and method of forming interconnect structure with conductive pads having expanded interconnect surface area for enhanced interconnection properties | OhHan Kim, SungWon Cho | 2016-06-21 |
| 9349666 | Integrated circuit packaging system with package stacking | JoHyun Bae, In Sang Yoon | 2016-05-24 |
| 9349616 | Semiconductor device and method of forming WLCSP with semiconductor die embedded within interconnect structure | KyungHoon Lee, HyunJin Song, Kyoungll Huh | 2016-05-24 |
| 9324659 | Semiconductor device and method of forming POP with stacked semiconductor die and bumps formed directly on the lower die | SungWon Cho, HyungSang Park, DongSoo Moon | 2016-04-26 |
| 9312218 | Semiconductor device and method of forming leadframe with conductive bodies for vertical electrical interconnect of semiconductor die | SooSan Park, HanGil Shin | 2016-04-12 |
| 9305897 | Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate | Jongho Kim, HyungMin Lee | 2016-04-05 |
| 9281228 | Semiconductor device and method of forming thermal interface material and heat spreader over semiconductor die | JoungIn Yang, Minjung Kim, Sang Mi Park, MinWook Yu | 2016-03-08 |
| 9252094 | Semiconductor device and method of forming an interconnect structure with conductive material recessed within conductive ring over surface of conductive pillar | Sang Mi Park | 2016-02-02 |
| 9252093 | Semiconductor device and method of forming multi-layered UBM with intermediate insulating buffer layer to reduce stress for semiconductor wafer | JoonYoung Choi, Wonll Kwon | 2016-02-02 |
| 9252032 | Semiconductor device and method of stacking semiconductor die in mold laser package interconnected by bumps and conductive vias | WonJun Ko, JaEun Yun | 2016-02-02 |
| 9190297 | Semiconductor device and method of forming a stackable semiconductor package with vertically-oriented discrete electrical devices as interconnect structures | YeongIm Park, HyungMin Lee | 2015-11-17 |
| 9153494 | Semiconductor die and method of forming Fo-WLCSP vertical interconnect using TSV and TMV | Young Jin Woo, Taewoo Lee | 2015-10-06 |
| 9142515 | Semiconductor device with protective layer over exposed surfaces of semiconductor die | Reza A. Pagaila, Jun Mo Koo | 2015-09-22 |
| 9093392 | Integrated circuit packaging system with vertical interconnection and method of manufacture thereof | SungWon Cho, JoHyun Bae, DongSoo Moon | 2015-07-28 |
| 9082887 | Integrated circuit packaging system with posts and method of manufacture thereof | Taewoo Lee, KyuWon Lee, SungWon Cho | 2015-07-14 |
| 9059108 | Integrated circuit packaging system with interconnects | JoonYoung Choi, YongHyuk Jeong | 2015-06-16 |