Issued Patents All Time
Showing 25 most recent of 56 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10903183 | Semiconductor device and method of using leadframe bodies to form openings through encapsulant for vertical interconnect of semiconductor die | HeeJo Chi, NamJu Cho | 2021-01-26 |
| 10510703 | Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package | HeeJo Chi, NamJu Cho | 2019-12-17 |
| 9966335 | Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die | NamJu Cho, HeeJo Chi | 2018-05-08 |
| 9865575 | Methods of forming conductive and insulating layers | HeeJo Chi, KyungMoon Kim | 2018-01-09 |
| 9842808 | Semiconductor device and method of forming vertical interconnect in FO-WLCSP using leadframe disposed between semiconductor die | NamJu Cho, HeeJo Chi | 2017-12-12 |
| 9748157 | Integrated circuit packaging system with joint assembly and method of manufacture thereof | HeeJo Chi, NamJu Cho, Kyung-Moon Kim | 2017-08-29 |
| 9691707 | Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package | HeeJo Chi, NamJu Cho | 2017-06-27 |
| 9558965 | Semiconductor device with thin profile WLCSP with vertical interconnect over package footprint | HeeJo Chi, NamJu Cho | 2017-01-31 |
| 9508635 | Methods of forming conductive jumper traces | HeeJo Chi, NamJu Cho | 2016-11-29 |
| 9496152 | Carrier system with multi-tier conductive posts and method of manufacture thereof | NamJu Cho, HeeJo Chi | 2016-11-15 |
| 9406533 | Methods of forming conductive and insulating layers | HeeJo Chi, KyungMoon Kim | 2016-08-02 |
| 9397050 | Semiconductor device and method of forming pre-molded semiconductor die having bumps embedded in encapsulant | HeeJo Chi, NamJu Cho | 2016-07-19 |
| 9362161 | Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package | HeeJo Chi, NamJu Cho | 2016-06-07 |
| 9355939 | Integrated circuit package stacking system with shielding and method of manufacture thereof | NamJu Cho, HeeJo Chi | 2016-05-31 |
| 9312218 | Semiconductor device and method of forming leadframe with conductive bodies for vertical electrical interconnect of semiconductor die | DaeSik Choi, SooSan Park | 2016-04-12 |
| 9299650 | Integrated circuit packaging system with single metal layer interposer and method of manufacture thereof | HeeJo Chi, NamJu Cho, Kyung-Moon Kim | 2016-03-29 |
| 9269691 | Semiconductor device and method of making an embedded wafer level ball grid array (EWLB) package on package (POP) device with a slotted metal carrier interposer | HeeJo Chi, NamJu Cho | 2016-02-23 |
| 9269595 | Semiconductor device with thin profile WLCSP with vertical interconnect over package footprint | HeeJo Chi, NamJu Cho | 2016-02-23 |
| 9263332 | Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMP | HeeJo Chi, NamJu Cho | 2016-02-16 |
| 9230898 | Integrated circuit packaging system with package-on-package and method of manufacture thereof | DeokKyung Yang, Jong-Woo Ha | 2016-01-05 |
| 9064859 | Semiconductor device and method of forming conductive posts and heat sink over semiconductor die using leadframe | HeeJo Chi, NamJu Cho | 2015-06-23 |
| 9048306 | Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMP | HeeJo Chi, NamJu Cho | 2015-06-02 |
| 8951834 | Methods of forming solder balls in semiconductor packages | Kyung-Moon Kim, Il Kwon Shim, HeeJo Chi | 2015-02-10 |
| 8932907 | Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die | NamJu Cho, HeeJo Chi | 2015-01-13 |
| 8901755 | Semiconductor device and method of forming conductive layer over metal substrate for electrical interconnect of semiconductor die | HeeJo Chi, NamJu Cho | 2014-12-02 |