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Electronic device, method for providing personal information using same, and computer-readable recording medium for recording same |
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Nonvolatile memory device and memory system including nonvolatile memory device that controls the erase speeds of cell strings |
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Nonvolatile memory device and memory system including nonvolatile memory device that controls the erase speeds of cell strings |
Sunyeong Lee, Woojae JANG, Chanjong Ju |
2020-06-30 |
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Semiconductor device and method of forming partition fence and shielding layer around semiconductor components |
Goo Hwa LEE, SooSan Park, KeoChang Lee |
2019-09-17 |
| 9865575 |
Methods of forming conductive and insulating layers |
HeeJo Chi, HanGil Shin |
2018-01-09 |
| 9721921 |
Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form |
KooHong Lee, JaeHak Yee, YoungChul Kim, Lan H. Hoang, Pandi C. Marimuthu +3 more |
2017-08-01 |
| 9406533 |
Methods of forming conductive and insulating layers |
HeeJo Chi, HanGil Shin |
2016-08-02 |
| 9287204 |
Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form |
KooHong Lee, JaeHak Yee, YoungChul Kim, Lan H. Hoang, Pandi C. Marimuthu +3 more |
2016-03-15 |
| 9252130 |
Methods of manufacturing flip chip semiconductor packages using double-sided thermal compression bonding |
YoungChul Kim, HunTeak Lee, KeonTaek Kang, HeeJo Chi |
2016-02-02 |
| 9245770 |
Semiconductor device and method of simultaneous molding and thermalcompression bonding |
KooHong Lee, JaeHak Yee, YoungChul Kim, Lan H. Hoang, Pandi C. Marimuthu +2 more |
2016-01-26 |
| 9240331 |
Semiconductor device and method of making bumpless flipchip interconnect structures |
KooHong Lee, JaeHak Yee, YoungChul Kim, Lan H. Hoang, Pandi C. Marimuthu +3 more |
2016-01-19 |
