Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10418332 | Semiconductor device and method of forming partition fence and shielding layer around semiconductor components | Goo Hwa LEE, KyungMoon Kim, KeoChang Lee | 2019-09-17 |
| 9859200 | Integrated circuit packaging system with interposer support structure mechanism and method of manufacture thereof | Kyusang Kim, YeoChan Ko, KeoChang Lee, HeeJo Chi, HeeSoo Lee | 2018-01-02 |
| 9312218 | Semiconductor device and method of forming leadframe with conductive bodies for vertical electrical interconnect of semiconductor die | DaeSik Choi, HanGil Shin | 2016-04-12 |