Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11670618 | System-in-package with double-sided molding | DeokKyung Yang, Yongmin Kim, Jaehyuk Choi, HeeSoo Lee | 2023-06-06 |
| 10797024 | System-in-package with double-sided molding | DeokKyung Yang, Yongmin Kim, Jaehyuk Choi, HeeSoo Lee | 2020-10-06 |
| 10636765 | System-in-package with double-sided molding | DeokKyung Yang, Yongmin Kim, Jaehyuk Choi, HeeSoo Lee | 2020-04-28 |
| 9859200 | Integrated circuit packaging system with interposer support structure mechanism and method of manufacture thereof | SooSan Park, Kyusang Kim, KeoChang Lee, HeeJo Chi, HeeSoo Lee | 2018-01-02 |