Issued Patents All Time
Showing 25 most recent of 85 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11688612 | Semiconductor device and method of forming interposer with opening to contain semiconductor die | Reza A. Pagaila, Yaojian Lin, Jun Mo Koo | 2023-06-27 |
| 10903183 | Semiconductor device and method of using leadframe bodies to form openings through encapsulant for vertical interconnect of semiconductor die | NamJu Cho, HanGil Shin | 2021-01-26 |
| 10573600 | Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP | NamJu Cho, Junwoo Myung | 2020-02-25 |
| 10510703 | Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package | HanGil Shin, NamJu Cho | 2019-12-17 |
| 9966335 | Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die | NamJu Cho, HanGil Shin | 2018-05-08 |
| 9875911 | Semiconductor device and method of forming interposer with opening to contain semiconductor die | Reza A. Pagaila, Yaojian Lin, Jun Mo Koo | 2018-01-23 |
| 9865575 | Methods of forming conductive and insulating layers | HanGil Shin, KyungMoon Kim | 2018-01-09 |
| 9865554 | Integrated circuit packaging system with under bump metallization and method of manufacture thereof | Il Kwon Shim, Kyung-Moon Kim, JunMo Koo, Bartholomew Liao Chung Foh, Zigmund Ramirez Camacho | 2018-01-09 |
| 9859200 | Integrated circuit packaging system with interposer support structure mechanism and method of manufacture thereof | SooSan Park, Kyusang Kim, YeoChan Ko, KeoChang Lee, HeeSoo Lee | 2018-01-02 |
| 9842808 | Semiconductor device and method of forming vertical interconnect in FO-WLCSP using leadframe disposed between semiconductor die | HanGil Shin, NamJu Cho | 2017-12-12 |
| 9748157 | Integrated circuit packaging system with joint assembly and method of manufacture thereof | HanGil Shin, NamJu Cho, Kyung-Moon Kim | 2017-08-29 |
| 9735113 | Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP | NamJu Cho, Junwoo Myung | 2017-08-15 |
| 9721921 | Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form | KyungMoon Kim, KooHong Lee, JaeHak Yee, YoungChul Kim, Lan H. Hoang +3 more | 2017-08-01 |
| 9691707 | Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package | HanGil Shin, NamJu Cho | 2017-06-27 |
| 9679769 | Integrated circuit packaging system with photoimagable dielectric-defined trace and method of manufacture thereof | Zigmund Ramirez Camacho, Bartholomew Liao Chung Foh, Sheila Marie L. Alvarez, Dao Nguyen Phu Cuong | 2017-06-13 |
| 9673171 | Integrated circuit packaging system with coreless substrate and method of manufacture thereof | HeeSoo Lee, OMin Kwon | 2017-06-06 |
| 9558965 | Semiconductor device with thin profile WLCSP with vertical interconnect over package footprint | NamJu Cho, HanGil Shin | 2017-01-31 |
| 9508635 | Methods of forming conductive jumper traces | HanGil Shin, NamJu Cho | 2016-11-29 |
| 9502267 | Integrated circuit packaging system with support structure and method of manufacture thereof | Bartholomew Liao Chung Foh, Sheila Marie L. Alvarez, Zigmund Ramirez Camacho, Dao Nguyen Phu Cuong | 2016-11-22 |
| 9496152 | Carrier system with multi-tier conductive posts and method of manufacture thereof | NamJu Cho, HanGil Shin | 2016-11-15 |
| 9406531 | Integrated circuit packaging system with photoimagable dielectric-defined trace and method of manufacture thereof | Zigmund Ramirez Camacho, Bartholomew Liao Chung Foh, Sheila Marie L. Alvarez, Dao Nguyen Phu Cuong | 2016-08-02 |
| 9406642 | Integrated circuit packaging system with insulated trace and method of manufacture thereof | Bartholomew Liao Chung Foh, Sheila Marie L. Alvarez, Zigmund Ramirez Camacho, Dao Nguyen Phu Cuong | 2016-08-02 |
| 9406533 | Methods of forming conductive and insulating layers | HanGil Shin, KyungMoon Kim | 2016-08-02 |
| 9397050 | Semiconductor device and method of forming pre-molded semiconductor die having bumps embedded in encapsulant | HanGil Shin, NamJu Cho | 2016-07-19 |
| 9391046 | Semiconductor device and method of forming 3D semiconductor package with semiconductor die stacked over semiconductor wafer | Yeonglm Park, HyungMin Lee | 2016-07-12 |