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HeeJo Chi — 85 Patents

SCStats Chippac: 83 patents #14 of 425Top 4%

JCJcet Semiconductor (Shaoxing) Co.: 1 patents #18 of 38Top 50%

Seojong-myeon, KR: #21 of 10,205 inventorsTop 1%

Overall (All Time): #20,018 of 4,157,543Top 1%

85 Patents All Time

HeeJo Chi has been granted 85 US patents while listed as an inventor at Stats Chippac. The first was granted in 2011 and the most recent in June 2023. HeeJo Chi ranks #20,018 of 4,157,543 US inventors in our database (top 0.48%). Patent records list HeeJo Chi in Seojong-myeon, KR.

Patents per Year

Issued Patents All Time

Showing 1–25 of 85 patents

Patent #	Title	Co-Inventors	Date
11688612	Semiconductor device and method of forming interposer with opening to contain semiconductor die	Reza A. Pagaila, Yaojian Lin, Jun Mo Koo	2023-06-27
10903183	Semiconductor device and method of using leadframe bodies to form openings through encapsulant for vertical interconnect of semiconductor die	NamJu Cho, HanGil Shin	2021-01-26
10573600	Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP	NamJu Cho, Junwoo Myung	2020-02-25
10510703	Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package	HanGil Shin, NamJu Cho	2019-12-17
9966335	Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die	NamJu Cho, HanGil Shin	2018-05-08
9875911	Semiconductor device and method of forming interposer with opening to contain semiconductor die	Reza A. Pagaila, Yaojian Lin, Jun Mo Koo	2018-01-23
9865575	Methods of forming conductive and insulating layers	HanGil Shin, KyungMoon Kim	2018-01-09
9865554	Integrated circuit packaging system with under bump metallization and method of manufacture thereof	Il Kwon Shim, Kyung-Moon Kim, JunMo Koo, Bartholomew Liao Chung Foh, Zigmund Ramirez Camacho	2018-01-09
9859200	Integrated circuit packaging system with interposer support structure mechanism and method of manufacture thereof	SooSan Park, Kyusang Kim, YeoChan Ko, KeoChang Lee, HeeSoo Lee	2018-01-02
9842808	Semiconductor device and method of forming vertical interconnect in FO-WLCSP using leadframe disposed between semiconductor die	HanGil Shin, NamJu Cho	2017-12-12
9748157	Integrated circuit packaging system with joint assembly and method of manufacture thereof	HanGil Shin, NamJu Cho, Kyung-Moon Kim	2017-08-29
9735113	Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP	NamJu Cho, Junwoo Myung	2017-08-15
9721921	Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form	KyungMoon Kim, KooHong Lee, JaeHak Yee, YoungChul Kim, Lan H. Hoang +3 more	2017-08-01
9691707	Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package	HanGil Shin, NamJu Cho	2017-06-27
9679769	Integrated circuit packaging system with photoimagable dielectric-defined trace and method of manufacture thereof	Zigmund Ramirez Camacho, Bartholomew Liao Chung Foh, Sheila Marie L. Alvarez, Dao Nguyen Phu Cuong	2017-06-13
9673171	Integrated circuit packaging system with coreless substrate and method of manufacture thereof	HeeSoo Lee, OMin Kwon	2017-06-06
9558965	Semiconductor device with thin profile WLCSP with vertical interconnect over package footprint	NamJu Cho, HanGil Shin	2017-01-31
9508635	Methods of forming conductive jumper traces	HanGil Shin, NamJu Cho	2016-11-29
9502267	Integrated circuit packaging system with support structure and method of manufacture thereof	Bartholomew Liao Chung Foh, Sheila Marie L. Alvarez, Zigmund Ramirez Camacho, Dao Nguyen Phu Cuong	2016-11-22
9496152	Carrier system with multi-tier conductive posts and method of manufacture thereof	NamJu Cho, HanGil Shin	2016-11-15
9406531	Integrated circuit packaging system with photoimagable dielectric-defined trace and method of manufacture thereof	Zigmund Ramirez Camacho, Bartholomew Liao Chung Foh, Sheila Marie L. Alvarez, Dao Nguyen Phu Cuong	2016-08-02
9406642	Integrated circuit packaging system with insulated trace and method of manufacture thereof	Bartholomew Liao Chung Foh, Sheila Marie L. Alvarez, Zigmund Ramirez Camacho, Dao Nguyen Phu Cuong	2016-08-02
9406533	Methods of forming conductive and insulating layers	HanGil Shin, KyungMoon Kim	2016-08-02
9397050	Semiconductor device and method of forming pre-molded semiconductor die having bumps embedded in encapsulant	HanGil Shin, NamJu Cho	2016-07-19
9391046	Semiconductor device and method of forming 3D semiconductor package with semiconductor die stacked over semiconductor wafer	Yeonglm Park, HyungMin Lee	2016-07-12