Issued Patents All Time
Showing 1–25 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10446523 | Semiconductor device and method of forming wire studs as vertical interconnect in FO-WLP | Pandi C. Marimuthu, Yaojian Lin, Jose Alvin Caparas, Yang Tan | 2019-10-15 |
| 9679769 | Integrated circuit packaging system with photoimagable dielectric-defined trace and method of manufacture thereof | Zigmund Ramirez Camacho, Bartholomew Liao Chung Foh, Dao Nguyen Phu Cuong, HeeJo Chi | 2017-06-13 |
| 9502267 | Integrated circuit packaging system with support structure and method of manufacture thereof | HeeJo Chi, Bartholomew Liao Chung Foh, Zigmund Ramirez Camacho, Dao Nguyen Phu Cuong | 2016-11-22 |
| 9443797 | Semiconductor device having wire studs as vertical interconnect in FO-WLP | Pandi C. Marimuthu, Yaojian Lin, Jose Alvin Caparas, Yang Tan | 2016-09-13 |
| 9406531 | Integrated circuit packaging system with photoimagable dielectric-defined trace and method of manufacture thereof | Zigmund Ramirez Camacho, Bartholomew Liao Chung Foh, Dao Nguyen Phu Cuong, HeeJo Chi | 2016-08-02 |
| 9406642 | Integrated circuit packaging system with insulated trace and method of manufacture thereof | HeeJo Chi, Bartholomew Liao Chung Foh, Zigmund Ramirez Camacho, Dao Nguyen Phu Cuong | 2016-08-02 |
| 9331003 | Integrated circuit packaging system with pre-molded leadframe and method of manufacture thereof | Zigmund Ramirez Camacho, Bartholomew Liao Chung Foh, Dao Nguyen Phu Cuong, HeeJo Chi | 2016-05-03 |
| 9330994 | Semiconductor device and method of forming RDL and vertical interconnect by laser direct structuring | Zigmund Ramirez Camacho, Bartholomew Liao, HeeJo Chi, Kelvin Dao | 2016-05-03 |
| 8405230 | Semiconductor flip chip package having substantially non-collapsible spacer and method of manufacture thereof | Jae Soo Lee, Geun Sik Kim, Robinson Quiazon, Hin Hwa Goh, Frederick R. Dahilig | 2013-03-26 |
| 8207598 | Semiconductor package heat spreader | Virgil Ararao, Il Kwon Shim, Seng Guan Chow | 2012-06-26 |
| 8174127 | Integrated circuit package system employing device stacking | Frederick R. Dahilig, Antonio B. Dimaano, Jr., Dioscoro A. Merilo | 2012-05-08 |
| 8120187 | Integrated circuit package system employing device stacking and method of manufacture thereof | Frederick R. Dahilig, Antonio B. Dimaano, Jr., Dioscoro A. Merilo | 2012-02-21 |
| 7880313 | Semiconductor flip chip package having substantially non-collapsible spacer | Jae Soo Lee, Geun Sik Kim, Robinson Quiazon, Hin Hwa Goh, Frederick R. Dahilig | 2011-02-01 |
| 7830020 | Integrated circuit package system employing device stacking | Frederick R. Dahilig, Antonio B. Dimaano, Jr., Dioscoro A. Merilo | 2010-11-09 |
| 7829384 | Semiconductor device and method of laser-marking wafers with tape applied to its active surface | Glenn Omandam, Ma. Shirley Asoy | 2010-11-09 |
| 7575956 | Fabrication method for semiconductor package heat spreaders | Virgil Ararao, Il Kwon Shim, Seng Guan Chow | 2009-08-18 |
| 7482683 | Integrated circuit encapsulation system with vent | Antonio B. Dimaano, Jr., Erick Dahilig, Robinson Quiazon, Jose Alvin Caparas | 2009-01-27 |
| 7443015 | Integrated circuit package system with downset lead | Jeffrey D. Punzalan, Jose Alvin Caparas, Robinson Quiazon | 2008-10-28 |
| 7414318 | Etched leadframe flipchip package system | Il Kwon Shim, Hin Hwa Goh, Robinson Quiazon | 2008-08-19 |
| 7352055 | Semiconductor package with controlled solder bump wetting | Il Kwon Shim, Sheila Rima C. Magno | 2008-04-01 |
| 7327025 | Heat spreader for thermally enhanced semiconductor package | Il Kwon Shim, Virgil Ararao | 2008-02-05 |
| 7250685 | Etched leadframe flipchip package system | Il Kwon Shim, Hin Hwa Goh, Robinson Quiazon | 2007-07-31 |
| 7169641 | Semiconductor package with selective underfill and fabrication method therfor | Il Kwon Shim, Romeo Emmanuel P. Alvarez | 2007-01-30 |
| 7153725 | Strip-fabricated flip chip in package and flip chip in system heat spreader assemblies and fabrication methods therefor | Tie Wang, Virgil Ararao, Il Kwon Shim | 2006-12-26 |
| 7148086 | Semiconductor package with controlled solder bump wetting and fabrication method therefor | Il Kwon Shim, Sheila Rima C. Magno | 2006-12-12 |