Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8293584 | Integrated circuit package system with filled wafer recess | Dennis Guillermo, Sheila Rima C. Magno, Pandi C. Marimuthu | 2012-10-23 |
| 7868434 | Integrated circuit package-on-package stacking system | Dioscoro A. Merilo, Heap Hoe Kuan, You Yang Ong, Seng Guan Chow | 2011-01-11 |
| 7829384 | Semiconductor device and method of laser-marking wafers with tape applied to its active surface | Glenn Omandam, Sheila Marie L. Alvarez | 2010-11-09 |
| 7718472 | Integrated circuit package-on-package stacking system and method of manufacture thereof | Dioscoro A. Merilo, Heap Hoe Kuan, You Yang Ong, Seng Guan Chow | 2010-05-18 |
| 7535086 | Integrated circuit package-on-package stacking system | Dioscoro A. Merilo, Heap Hoe Kuan, You Yang Ong, Seng Guan Chow | 2009-05-19 |