Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8536689 | Integrated circuit package system with multi-surface die attach pad | Antonio B. Dimaano, Jr., Il Kwon Shim, Dennis Guillermo | 2013-09-17 |
| 8293584 | Integrated circuit package system with filled wafer recess | Dennis Guillermo, Ma. Shirley Asoy, Pandi C. Marimuthu | 2012-10-23 |
| 7863108 | Integrated circuit packaging system with etched ring and die paddle and method of manufacture thereof | Antonio B. Dimaano, Jr., Il Kwon Shim | 2011-01-04 |
| 7556987 | Method of fabricating an integrated circuit with etched ring and die paddle | Antonio B. Dimaano, Jr., Il Kwon Shim | 2009-07-07 |
| 7541222 | Wire sweep resistant semiconductor package and manufacturing method therefor | Byung Tai Do, Dennis Guillermo, Antonio B. Dimaano, Jr. | 2009-06-02 |
| 7352055 | Semiconductor package with controlled solder bump wetting | Il Kwon Shim, Sheila Marie L. Alvarez | 2008-04-01 |
| 7148086 | Semiconductor package with controlled solder bump wetting and fabrication method therefor | Il Kwon Shim, Sheila Marie L. Alvarez | 2006-12-12 |
| 7141886 | Air pocket resistant semiconductor package | Antonio B. Dimaano, Jr., Byung Tai Do, Dennis Guillermo | 2006-11-28 |
| 6969640 | Air pocket resistant semiconductor package system | Antonio Bambalan DIMAANO JR., Byung Tai Do, Dennis Guillermo | 2005-11-29 |