Issued Patents All Time
Showing 26–27 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6802445 | Cost effective substrate fabrication for flip-chip packages | Il Kwon Shim, Jian Li | 2004-10-12 |
| 6775140 | Heat spreaders, heat spreader packages, and fabrication methods for use with flip chip semiconductor devices | Il Kwon Shim, Seng Guan Chow, Virgil Ararao, Roger Emigh | 2004-08-10 |