Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8487438 | Integrated circuit system having different-size solder bumps and different-size bonding pads | Yaojian Lin, Byung Tai Do | 2013-07-16 |
| 8008770 | Integrated circuit package system with bump pad | Yaojian Lin, Haijing Cao, Wan Lay Looi | 2011-08-30 |
| 7566650 | Integrated circuit solder bumping system | Yaojian Lin, Byung Tai Do | 2009-07-28 |
| 7410824 | Method for solder bumping, and solder-bumping structures produced thereby | Byung Tai Do, Yaojian Lin | 2008-08-12 |
| 7169641 | Semiconductor package with selective underfill and fabrication method therfor | Il Kwon Shim, Sheila Marie L. Alvarez | 2007-01-30 |
| 6732913 | Method for forming a wafer level chip scale package, and package formed thereby | — | 2004-05-11 |
| 6510976 | Method for forming a flip chip semiconductor package | Tan Kim Hwee | 2003-01-28 |