Issued Patents All Time
Showing 1–25 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10211183 | Semiconductor device and method of forming shielding layer over integrated passive device using conductive channels | Yaojian Lin, Jianmin Fang, Kang Chen | 2019-02-19 |
| 10192801 | Semiconductor device and method of forming vertical interconnect structure in substrate for IPD and baseband circuit separated by high-resistivity molding compound | Yaojian Lin, Jianmin Fang, Kang Chen | 2019-01-29 |
| 9865482 | Semiconductor device and method of forming a fan-out structure with integrated passive device and discrete component | Yaojian Lin, Jianmin Fang, Kang Chen | 2018-01-09 |
| 9449925 | Integrated passive devices | Yaojian Lin, Qing Zhang, Kang Chen, Jianmin Fang | 2016-09-20 |
| 9349723 | Semiconductor device and method of forming passive devices | Yaojian Lin, Qing Zhang, Robert C. Frye | 2016-05-24 |
| 9337141 | Method of forming an inductor on a semiconductor wafer | Yaojian Lin, Qing Zhang | 2016-05-10 |
| 9324700 | Semiconductor device and method of forming shielding layer over integrated passive device using conductive channels | Yaojian Lin, Jianmin Fang, Kang Chen | 2016-04-26 |
| 9269598 | Semiconductor device and method of forming an IPD over a high-resistivity encapsulant separated from other IPDS and baseband circuit | Yaojian Lin, Jianmin Fang, Kang Chen | 2016-02-23 |
| 9240384 | Semiconductor device with solder bump formed on high topography plated Cu pads | Yaojian Lin, Qing Zhang | 2016-01-19 |
| 9184103 | Semiconductor device having embedded integrated passive devices electrically interconnected using conductive pillars | Yaojian Lin, Kang Chen, Jianmin Fang | 2015-11-10 |
| 8975111 | Wafer level die integration and method therefor | Yaojian Lin | 2015-03-10 |
| 8669637 | Integrated passive device system | Yaojian Lin, Robert C. Frye, Pandi C. Marimuthu | 2014-03-11 |
| 8592311 | Semiconductor device and method for forming passive circuit elements with through silicon vias to backside interconnect structures | Yaojian Lin, Qing Zhang, Kang Chen, Jianmin Fang | 2013-11-26 |
| 8445323 | Semiconductor package with semiconductor core structure and method of forming same | Yaojian Lin, Jianmin Fang, Kang Chen | 2013-05-21 |
| 8409970 | Semiconductor device and method of making integrated passive devices | Yaojian Lin, Qing Zhang, Kang Chen, Jianmin Fang | 2013-04-02 |
| 8395053 | Circuit system with circuit element and reference plane | Yaojian Lin, Qing Zhang | 2013-03-12 |
| 8389396 | Method for manufacture of integrated circuit package system with protected conductive layers for pads | Yaojian Lin, Qing Zhang | 2013-03-05 |
| 8310058 | Semiconductor device and method for forming passive circuit elements with through silicon vias to backside interconnect structures | Yaojian Lin, Qing Zhang, Kang Chen, Jianmin Fang | 2012-11-13 |
| 8309452 | Method of forming an inductor on a semiconductor wafer | Yaojian Lin, Qing Zhang | 2012-11-13 |
| 8304904 | Semiconductor device with solder bump formed on high topography plated Cu pads | Yaojian Lin, Qing Zhang | 2012-11-06 |
| 8263437 | Semiconductor device and method of forming an IPD over a high-resistivity encapsulant separated from other IPDS and baseband circuit | Yaojian Lin, Jianmin Fang, Kang Chen | 2012-09-11 |
| 8193604 | Semiconductor package with semiconductor core structure and method of forming the same | Yaojian Lin, Jianmin Fang, Kang Chen | 2012-06-05 |
| 8183087 | Semiconductor device and method of forming a fan-out structure with integrated passive device and discrete component | Yaojian Lin, Jianmin Fang, Kang Chen | 2012-05-22 |
| 8168470 | Semiconductor device and method of forming vertical interconnect structure in substrate for IPD and baseband circuit separated by high-resistivity molding compound | Yaojian Lin, Jianmin Fang, Kang Chen | 2012-05-01 |
| 8134196 | Integrated circuit system with metal-insulator-metal circuit element | Yaojian Lin, Wan Lay Looi, Eng Seng Lim | 2012-03-13 |