QZ

Qing Zhang

SC Stats Chippac: 19 patents #47 of 425Top 15%
CL Cambridge Enterprise Limited: 2 patents #106 of 688Top 20%
TC The Chancellor, Masters, And Scholars Of The University Of Cambridge: 1 patents #6 of 25Top 25%
TO Toto: 1 patents #620 of 1,113Top 60%
Overall (All Time): #179,980 of 4,157,543Top 5%
23
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
11874459 Display device for head-mounting and display method Tao Lin, Jia Jia, Pawan Shrestha, Matt Pryn, Daping Chu 2024-01-16
11409118 Device and method for generating a 3D light field Jia Jia, Jhensi Chen, Daping Chu, Tao Lin 2022-08-09
11252383 System, apparatus and method for displaying image data Jhensi Chen, Jia Jia, Daping Chu, Tao Lin 2022-02-15
9449925 Integrated passive devices Yaojian Lin, Haijing Cao, Kang Chen, Jianmin Fang 2016-09-20
9349723 Semiconductor device and method of forming passive devices Yaojian Lin, Haijing Cao, Robert C. Frye 2016-05-24
9337141 Method of forming an inductor on a semiconductor wafer Yaojian Lin, Haijing Cao 2016-05-10
9240384 Semiconductor device with solder bump formed on high topography plated Cu pads Yaojian Lin, Haijing Cao 2016-01-19
8592311 Semiconductor device and method for forming passive circuit elements with through silicon vias to backside interconnect structures Yaojian Lin, Haijing Cao, Kang Chen, Jianmin Fang 2013-11-26
8409970 Semiconductor device and method of making integrated passive devices Yaojian Lin, Haijing Cao, Kang Chen, Jianmin Fang 2013-04-02
8395053 Circuit system with circuit element and reference plane Yaojian Lin, Haijing Cao 2013-03-12
8389396 Method for manufacture of integrated circuit package system with protected conductive layers for pads Yaojian Lin, Haijing Cao 2013-03-05
8309452 Method of forming an inductor on a semiconductor wafer Yaojian Lin, Haijing Cao 2012-11-13
8310058 Semiconductor device and method for forming passive circuit elements with through silicon vias to backside interconnect structures Yaojian Lin, Haijing Cao, Kang Chen, Jianmin Fang 2012-11-13
8304904 Semiconductor device with solder bump formed on high topography plated Cu pads Yaojian Lin, Haijing Cao 2012-11-06
8166997 Toilet flush water supply device Eiji Fukuzawa, Yoshinobu Uchimura, Shan Lin, Fu-Shan Chen 2012-05-01
8124490 Semiconductor device and method of forming passive devices Yaojian Lin, Haijing Cao, Robert C. Frye 2012-02-28
8026593 Integrated circuit package system with protected conductive layers for pads and method of manufacturing thereof Yaojian Lin, Haijing Cao 2011-09-27
7790503 Semiconductor device and method of forming integrated passive device module Yaojian Lin, Haijing Cao, Kang Chen, Jianmin Fang 2010-09-07
7772106 Method of forming an inductor on a semiconductor wafer Yaojian Lin, Haijing Cao 2010-08-10
7749814 Semiconductor device with integrated passive circuit and method of making the same using sacrificial substrate Yaojian Lin, Haijing Cao, Kang Chen, Jianmin Fang 2010-07-06
7727876 Semiconductor device and method of protecting passivation layer in a solder bump process Yaojian Lin, Haijing Cao 2010-06-01
7691747 Semiconductor device and method for forming passive circuit elements with through silicon vias to backside interconnect structures Yaojian Lin, Haijing Cao, Kang Chen, Jianmin Fang 2010-04-06
7682959 Method of forming solder bump on high topography plated Cu Yaojian Lin, Haijing Cao 2010-03-23