Issued Patents All Time
Showing 25 most recent of 300 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381141 | Semiconductor device and method of forming hybrid substrate with uniform thickness | Linda Pei Ee Chua, Jian Zuo, Hin Hwa Goh | 2025-08-05 |
| 12319564 | Semiconductor device and method of forming microelectromechanical systems (MEMS) package | Won Kyoung Choi, Kang Chen, Ivan Micallef | 2025-06-03 |
| 12300590 | Package structure and method for forming same | — | 2025-05-13 |
| 12249582 | SIP package structure | Xueqing Chen, SHASHA ZHOU, Jian-Hong Chen, Shuo Liu, Danfeng Yang | 2025-03-11 |
| 12148681 | Fan-out package structure and method for manufacturing the same | Jian Zuo, Danfeng Yang, Yinghua Gao, Shuo Liu | 2024-11-19 |
| 12107058 | Split RDL connection between die and UBM | Jian Zuo | 2024-10-01 |
| 12094843 | Antenna in embedded wafer-level ball-grid array package | Pandi C. Marimuthu, Andy Chang Bum Yong, Aung Kyaw Oo | 2024-09-17 |
| 12094729 | Semiconductor device with encapsulant deposited along sides and surface edge of semiconductor die in embedded WLCSP | Heinz-Peter Wirtz, Seung Wook Yoon, Pandi C. Marimuthu | 2024-09-17 |
| 12080600 | Semiconductor device and method to minimize stress on stack via | Seng Guan Chow | 2024-09-03 |
| 12074116 | Integrated package structure | Haitao Shi, Xueqing Chen, Jian-Hong Chen, SHASHA ZHOU, Shuo Liu | 2024-08-27 |
| 11978694 | Dual-substrate antenna package structure and method for manufacturing the same | Shuo Liu, Chen Xu, Haitao Shi | 2024-05-07 |
| 11961764 | Semiconductor device and method of making a wafer-level chip-scale package | Thomas Strothmann, Damien M. Pricolo, Il Kwon Shim, Heinz-Peter Wirtz, Seung Wook Yoon +1 more | 2024-04-16 |
| 11854949 | Package structure having a plurality of chips attached to a lead frame by redistribution layer | Danfeng Yang, Shuo Liu, CHENYE HE | 2023-12-26 |
| 11688612 | Semiconductor device and method of forming interposer with opening to contain semiconductor die | Reza A. Pagaila, Jun Mo Koo, HeeJo Chi | 2023-06-27 |
| 11569136 | Semiconductor device and method of forming dual-sided interconnect structures in FO-WLCSP | Kang Chen | 2023-01-31 |
| 11488838 | Semiconductor device having an embedded conductive layer for power/ground planes in Fo-eWLB | Xu Sheng Bao, Kang Chen | 2022-11-01 |
| 11488932 | Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages | Byung Joon Han, Il Kwon Shim, Pandi C. Marimuthu | 2022-11-01 |
| 11488933 | Semiconductor device and method of forming embedded wafer level chip scale packages | Pandi C. Marimuthu, Il Kwon Shim, Byung Joon Han | 2022-11-01 |
| 11469191 | Antenna in embedded wafer-level ball-grid array package | Pandi C. Marimuthu, Andy Chang Bum Yong, Aung Kyaw Oo | 2022-10-11 |
| 11370655 | Semiconductor device and method of forming microelectromechanical systems (MEMS) package | Won Kyoung Choi, Kang Chen, Ivan Micallef | 2022-06-28 |
| 11319207 | Semiconductor device and method of forming MEMS package | Il Kwon Shim | 2022-05-03 |
| 11257729 | Semiconductor device and method of forming encapsulated wafer level chip scale package (eWLCSP) | Thomas Strothmann, Seung Wook Yoon | 2022-02-22 |
| 11222793 | Semiconductor device with encapsulant deposited along sides and surface edge of semiconductor die in embedded WLCSP | Heinz-Peter Wirtz, Seung Wook Yoon, Pandi C. Marimuthu | 2022-01-11 |
| 11145603 | Integrated circuit packaging system with shielding and method of manufacture thereof | Byung Joon Han, Il Kwon Shim, KyoungHee Park, KyoWang Koo, In Sang Yoon +5 more | 2021-10-12 |
| 11127666 | Semiconductor device and method of forming openings through insulating layer over encapsulant for enhanced adhesion of interconnect structure | Kang Chen, Jianmin Fang | 2021-09-21 |