Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12094729 | Semiconductor device with encapsulant deposited along sides and surface edge of semiconductor die in embedded WLCSP | Yaojian Lin, Heinz-Peter Wirtz, Pandi C. Marimuthu | 2024-09-17 |
| 12096217 | PUF-based IoT device using channel state information, and authentication method thereof | Eui Seok Hwang, Seung Nam HAN | 2024-09-17 |
| 11961764 | Semiconductor device and method of making a wafer-level chip-scale package | Thomas Strothmann, Damien M. Pricolo, Il Kwon Shim, Yaojian Lin, Heinz-Peter Wirtz +1 more | 2024-04-16 |
| 11257729 | Semiconductor device and method of forming encapsulated wafer level chip scale package (eWLCSP) | Thomas Strothmann, Yaojian Lin | 2022-02-22 |
| 11222793 | Semiconductor device with encapsulant deposited along sides and surface edge of semiconductor die in embedded WLCSP | Yaojian Lin, Heinz-Peter Wirtz, Pandi C. Marimuthu | 2022-01-11 |
| 11011423 | Semiconductor device and method of using a standardized carrier in semiconductor packaging | Thomas Strothmann, Damien M. Pricolo, Il Kwon Shim, Yaojian Lin, Heinz-Peter Wirtz +1 more | 2021-05-18 |
| 10903304 | Semiconductor device and method of forming inductor over insulating material filled trench in substrate | Meenakshi Padmanathan, YongTaek Lee | 2021-01-26 |
| 10622293 | Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (EWLB-MLP) | Jose Alvin Caparas, Yaojian Lin, Pandi C. Marimuthu, Kang Chen, Xusheng Bao +1 more | 2020-04-14 |
| 10515828 | Method of depositing encapsulant along sides and surface edge of semiconductor die in embedded WLCSP | Yaojian Lin, Heinz-Peter Wirtz, Pandi C. Marimuthu | 2019-12-24 |
| 10475779 | Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP | Yaojian Lin, Kang Chen | 2019-11-12 |
| 10446459 | Semiconductor device and method of forming encapsulated wafer level chip scale package (EWLCSP) | Thomas Strothmann, Yaojian Lin | 2019-10-15 |
| 10213396 | Patch to enhance locally fat metabolism, using thermoplastic elastomer gel composition including capsaicin | Kyu Hak Cho | 2019-02-26 |
| 10181423 | Semiconductor device and method of using a standardized carrier in semiconductor packaging | Thomas Strothmann, Damien M. Pricolo, Il Kwon Shim, Yaojian Lin, Heinz-Peter Wirtz +1 more | 2019-01-15 |
| 9768155 | Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP | Yaojian Lin, Kang Chen | 2017-09-19 |
| 9704769 | Semiconductor device and method of forming encapsulated wafer level chip scale package (EWLCSP) | Thomas Strothmann, Yaojian Lin | 2017-07-11 |
| 9640603 | Semiconductor device and method of forming inductor over insulating material filled trench in substrate | Meenakshi Padmanathan, YongTaek Lee | 2017-05-02 |
| 9620413 | Semiconductor device and method of using a standardized carrier in semiconductor packaging | Thomas Strothmann, Damien M. Pricolo, Il Kwon Shim, Yaojian Lin, Heinz-Peter Wirtz +1 more | 2017-04-11 |
| 9496195 | Semiconductor device and method of depositing encapsulant along sides and surface edge of semiconductor die in embedded WLCSP | Yaojian Lin, Heinz-Peter Wirtz, Pandi C. Marimuthu | 2016-11-15 |
| 9293401 | Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (EWLP-MLP) | Jose Alvin Caparas, Yaojian Lin, Pandi C. Marimuthu, Kang Chen, Xusheng Bao +1 more | 2016-03-22 |
| 9224647 | Semiconductor device and method of forming TSV interposer with semiconductor die and build-up interconnect structure on opposing surfaces of the interposer | Jun Mo Koo, Pandi C. Marimuthu, Jae Hun Ku | 2015-12-29 |
| 9224693 | Semiconductor device and method of forming TMV and TSV in WLCSP using same carrier | Reza A. Pagaila, Yaojian Lin | 2015-12-29 |
| 9064936 | Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP | Yaojian Lin, Kang Chen | 2015-06-23 |
| 8993377 | Semiconductor device and method of bonding different size semiconductor die at the wafer level | Jun Mo Koo, Pandi C. Marimuthu, Il Kwon Shim | 2015-03-31 |
| 7160756 | Polymer encapsulated dicing lane (PEDL) technology for Cu/low/ultra-low k devices | Vaidyanathan Kripesh, Ganesh Vetrivel Periasamy | 2007-01-09 |