Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8816390 | System and method for an electronic package with a fail-open mechanism | Carlo Marbella, Kok Kiat Koo, Ai Min Tan | 2014-08-26 |
| 7592703 | RF and MMIC stackable micro-modules | Vaidyanathan Kripesh, Mihai Rotaru, Seung Uk Yoon, Ranganathan Nagarajan | 2009-09-22 |
| 7230318 | RF and MMIC stackable micro-modules | Vaidyanathan Kripesh, Mihai Rotaru, Seung Uk Yoon, Ranganathan Nagarajan | 2007-06-12 |
| 7160756 | Polymer encapsulated dicing lane (PEDL) technology for Cu/low/ultra-low k devices | Vaidyanathan Kripesh, Seung Wook Yoon | 2007-01-09 |
| 7141487 | Method for ultra thinning bumped wafers for flip chip | Vaidyanathan Kripesh | 2006-11-28 |